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Interconnects

An additional component in a fuel cell is the interconnects or bipolar plates. This is a vital component in SOFC development, since it forms the connection between the anode of one cell and the cathode of the next in a stacked arrangement. That is, these components operate as connections between individual fuel cells in a fuel cell stack [128], Then, the interconnects have to be electronically conductive and also possess good impermeability, chemical stability, and good mechanical properties since these components seal the gas chambers for the oxygen and fuel gas feed at either the anode or the cathode [66,137], [Pg.410]

The interconnect provides an electrical connection between two neighbouring cells [Pg.115]

Usually two approaches are used while fabricating the interconnect materials, i.e., ceramic and metallic. Ceramic oxides possess stability in an oxidising atmosphere but possess lower conductivities as compared to the metals. Usually ceramic oxides are used at higher temperatures and metals are used at lower temperatures. [Pg.116]


Thus the complexity of chemical process synthesis is twofold. First, can we identify all possible structures Second, can we optimize each structure for a valid comparison When optimizing the structure, there may be many ways in which each individual task can be performed and many ways in which the individual tasks can be interconnected. This means that we must simulate and optimize... [Pg.4]

In order to obtain the interested dependences it is necessary to fix the interconnection between the detected voltages U, Uo and the object parameters T, 1, h, the distances between tbe electrodes Rt, Rp are given (Fig. 1). [Pg.645]

The specific character of NDT related to the quality assessment of safety critical products and objects requires constant analysis and continuous improvement of processes and their interconnection. Sometimes interaction of processes is very complicated (Figure 3) therefore the processes have to be systematized and simplified when possible to realize total quality management in NDT. [Pg.954]

A new dimension to acid-base systems has been developed with the use of zeolites. As illustrated in Fig. XVIII-21, the alumino-silicate faujasite has an open structure of interconnected cavities. By exchanging for alkali metal (or NH4 and then driving off ammonia), acid zeolites can be obtained whose acidity is comparable to that of sulfuric acid and having excellent catalytic properties (see Section XVIII-9D). Using spectral shifts, zeolites can be put on a relative acidity scale [195]. An important added feature is that the size of the channels and cavities, which can be controlled, gives selectivity in that only... [Pg.719]

In figure A3.3.9 the early-time results of the interface fonnation are shown for = 0.48. The classical spinodal corresponds to 0.58. Interface motion can be simply monitored by defining the domain boundary as the location where i = 0. Surface tension smooths the domain boundaries as time increases. Large interconnected clusters begin to break apart into small circular droplets around t = 160. This is because the quadratic nonlinearity eventually outpaces the cubic one when off-criticality is large, as is the case here. [Pg.743]

Figure C2.12.7. Channel system of MFI (top) and MEL (bottom). The linear channels are interconnected by zigzag channels in ZSM-5 while exclusively straight miming channels are present in ZSM-11 - larger internal openings are present at the chaimel intersections - the arrows indicate the pathways for molecular transport tlirough the channel system. Figure C2.12.7. Channel system of MFI (top) and MEL (bottom). The linear channels are interconnected by zigzag channels in ZSM-5 while exclusively straight miming channels are present in ZSM-11 - larger internal openings are present at the chaimel intersections - the arrows indicate the pathways for molecular transport tlirough the channel system.
Eigure a shows that the eigensurfaces form an interconnected double sheet, the lower member of which has a ring of equivalent minima at r = and IV = — k. As expected angular momentum is conserved, but with the complication that it is vibronic, rather than purely vibrational in character. [Pg.18]

Fig. 5. Rigid-body analysis of citrate synthase, using two X-ray structures (after Hayward and Berendsen, Proteins 30 (1998) 144). The decomposition of the protein into two domains (dark gray and white) and two interconnecting regions (light gray) is shown, together with the hinge axis for the closing/opening motion between them. Fig. 5. Rigid-body analysis of citrate synthase, using two X-ray structures (after Hayward and Berendsen, Proteins 30 (1998) 144). The decomposition of the protein into two domains (dark gray and white) and two interconnecting regions (light gray) is shown, together with the hinge axis for the closing/opening motion between them.
Altogether, the three different models discussed so far are interconnected as sketched in Fig. 2. Now, we can by-pass the problems connected to caustics For e being small enough QCMD is justified as an approximation of QD if we exclude energy level crossings and discontinuities of the spectral decomposition. [Pg.388]

The complexity analysis shows that the load is evenly balanced among processors and therefore we should expect speedup close to P and efficiency close to 100%. There are however few extra terms in the expression of the time complexity (first order terms in TV), that exist because of the need to compute the next available row in the force matrix. These row allocations can be computed ahead of time and this overhead can be minimized. This is done in the next algorithm. Note that, the communication complexity is the worst case for all interconnection topologies, since simple broadcast and gather on distributed memory parallel systems are assumed. [Pg.488]

In contrast to canonical linear notations and connection tables (see Sections 2.3 and 2.4), fragment codes arc ambiguous. Several different structures could all possess an identical fragment code, because the code docs not describe how the fragments arc interconnected. Moreover, it is not always evident to the user whether all possible fi aginents of the stmetures ai e at all accessible. Thus, the fragments more or less characterise a class of molecules this is also important in generic structures that arise in chemical patents (sec Section 2.7.1)... [Pg.71]

The very appearance of figure lOJ-20 - and of the poster Biochemical Pathways as a whole [20] - clearly points out the deficiencies of a two-dimensional medium, a drawing plane, to represent the complexity, the high interconnectivity of biochemical pathways. [Pg.564]

The lead discovery process is depicted in Figure 10.4-4 and shows how the different methods are interconnected. A lead structure can be discovered by serendipity. In rational drug design all information available about a target serves to direct... [Pg.605]

At the present time there exist no flux relations wich a completely sound cheoretical basis, capable of describing transport in porous media over the whole range of pressures or pore sizes. All involve empiricism to a greater or less degree, or are based on a physically unrealistic representation of the structure of the porous medium. Existing models fall into two main classes in the first the medium is modeled as a network of interconnected capillaries, while in the second it is represented by an assembly of stationary obstacles dispersed in the gas on a molecular scale. The first type of model is closely related to the physical structure of the medium, but its development is hampered by the lack of a solution to the problem of transport in a capillary whose diameter is comparable to mean free path lengths in the gas mixture. The second type of model is more tenuously related to the real medium but more tractable theoretically. [Pg.3]

A porous medium may be regarded as a complex assembly of interconnected channels and, if each of these is regarded as a capillary Cube, one is led to speculate that a flux relation of the algebraic form (2.5) might be appropriate v en all the channels have diameters much smaller chan the mean... [Pg.9]

When a model is based on a picture of an interconnected network of pores of finite size, the question arises whether it may be assumed that the composition of the gas in the pores can be represented adequately by a smooth function of position in the medium. This is always true in the dusty gas model, where the solid material is regarded as dispersed on a molecular scale in the gas, but Is by no means necessarily so when the pores are pictured more realistically, and may be long compared with gaseous mean free paths. To see this, consider a reactive catalyst pellet with Long non-branching pores. The composition at a point within a given pore is... [Pg.63]

Other techniques that work well on small computers are based on the molecules topology or indices from graph theory. These fields of mathematics classify and quantify systems of interconnected points, which correspond well to atoms and bonds between them. Indices can be defined to quantify whether the system is linear or has many cyclic groups or cross links. Properties can be empirically fitted to these indices. Topological and group theory indices are also combined with group additivity techniques or used as QSPR descriptors. [Pg.308]

As Everett points out, however, the analogy of a pore as a narrownecked bottle is over-specialized, and in practice a series of interconnected pore spaces rather than discrete bottles is more likely. The progress of capillary condensation and evaporation in pores of this kind (cf. Fig. 3.13) has been discussed by de Boer, and more recently by Everett. ... [Pg.129]

By electronic engineering, a system of interconnected switching devices is able to respond in one of only two modes (on or off), and these modes can be controlled at the basic level of a bit. Bits are assembled into bytes, as with an 8-bit device, and through programming of the bytes a computer central processor can be made to follow sets of instructions (programs) written in special languages, either at a direct level (machine code) that can be acted upon immediately by a computer or at a high level that is translated for the user into machine code. [Pg.310]

Electrical Applications. The largest application of PTFE is for hookup and hookup-type wire used in electronic equipment in the military and aerospace industries. Coaxial cables, the second largest appHcation, use tapes made from fine powder resins and some from granular resin. Interconnecting wire appHcations include airframes. Other electrical appHcations include computer wire, electrical tape, electrical components, and spaghetti tubing. [Pg.355]

An electrochemical vapor deposition (EVD) technique has been developed that produces thin layers of refractory oxides that are suitable for the electrolyte and cell interconnection in SOFCs (9). In this technique, the appropriate metal chloride (MeCl ) vapor is introduced on one side of a porous support tube, and H2/H2O gas is introduced on the other side. The gas environments on both sides of the support tube act to form two galvanic couples, ie. [Pg.581]

The result is the formation of a dense and uniform metal oxide layer in which the deposition rate is controlled by the diffusion rate of ionic species and the concentration of electronic charge carriers. This procedure is used to fabricate the thin layer of soHd electrolyte (yttria-stabilized 2irconia) and the interconnection (Mg-doped lanthanum chromite). [Pg.581]


See other pages where Interconnects is mentioned: [Pg.1]    [Pg.9]    [Pg.473]    [Pg.579]    [Pg.344]    [Pg.2769]    [Pg.2912]    [Pg.3013]    [Pg.111]    [Pg.230]    [Pg.234]    [Pg.407]    [Pg.67]    [Pg.77]    [Pg.552]    [Pg.211]    [Pg.186]    [Pg.1]    [Pg.203]    [Pg.314]    [Pg.442]    [Pg.311]    [Pg.315]    [Pg.385]    [Pg.493]    [Pg.257]    [Pg.389]    [Pg.362]    [Pg.581]   
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286 / Lead-Free Solder Interconnect

3D interconnect

ACA interconnects

Accelerated Testing Methodology for Lead-Free Solder Interconnects

Air-gap interconnects

Alloys metallic interconnect

Assembly process Interconnect method

Ballpoint Pen Interconnection

Binding interconnection

Brain interconnections of, diagram

Capillary interconnected

Cathodes interconnect

Cell Interconnections

Cell interconnect

Cellulose interconnections

Central nervous system interconnectivity

Ceramic Interconnect Technology Handbook

Ceramic Interconnects (Lanthanum and Yttrium Chromites)

Ceramic interconnect technology

Ceramic interconnect technology applications

Ceramic interconnect technology thick-film metallizations

Ceramic interconnects

Ceramic interconnects chemical compatibility

Ceramic interconnects mechanical properties

Ceramic interconnects physical properties

Ceramic interconnects processing

Ceramic interconnects stability

Ceramic interconnects volatilization

Chip interconnect

Chip interconnection

Chip-package interconnect

Coatings on Interconnect

Computers, interconnects

Copper interconnect

Copper interconnect wiring formation

Copper interconnects

Copper interconnects electrodeposition

Copper interconnects for ceramic substrates

Copper interconnects for ceramic substrates and packages

Costs interconnects

Cu Interconnections on Chips

Current density, interconnects

Current-Carrying Capacity and Interconnect Resistance

Delay gate / interconnection

Deposition of Cu Interconnections on Chips

Design issues interconnects

Development interconnected structure

Die interconnection

Dielectric materials interconnects

Different Interconnects for SOFC

Effect of interconnecting pores

Electric power substations interconnection

Electrical conductivity interconnects

Electrical interconnects

Electrical tests interconnect resistance

Electronics packaging and interconnection

Establishing Hydraulic Interconnections

Evolution and Interfacial Interactions in Lead-Free Solder Interconnects

Fabrication interconnection

Fe-Cr alloy metallic interconnection

Ferritic steel interconnects

Flexible Sensor Array for a Robotic Fingertip Using Organic Thin Film Transistors (OTFT) with Minimum Interconnects and Improved Noise Tolerance

Fluidic interconnects

Foil interconnects

Free Solder Interconnect Reliability

Free Solder Interconnect Reliability Outlook

Fuel cells interconnect

Fuel cells interconnects

Fully interconnected layers

Glass/interconnect

Glass/interconnect interface

Glycolysis interconnection

Grid Array Interconnect

Hemicelluloses interconnections

High Density Interconnect Advantages

High Density Interconnect Characterization

High Density Interconnect Design

High Density Interconnect Dielectric material

High Density Interconnect Fabrication

High Density Interconnect Materials

High Density Interconnect Microvia material

High Density Interconnect Specifications

High Density Interconnect Standards

High Density Interconnect Structures

High current density interconnects

High-density interconnect

ICA interconnects

Inconel interconnects

Infiltration Interconnected

Integrated circuits interconnects

Interconnect

Interconnect

Interconnect 5,83 netlist

Interconnect Delay Impact on Performance

Interconnect Materials

Interconnect Technology In Semiconductor Manufacturing

Interconnect ceramic

Interconnect device

Interconnect materials, for

Interconnect metallic

Interconnect process trends

Interconnect resistance

Interconnect scaling

Interconnect stress test

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Interconnect-supported cells

Interconnected

Interconnected

Interconnected Architecture of the Chimney and Roof Regions

Interconnected Fluidized Bed Reactors

Interconnected cavity channels

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Interconnected interface

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Interconnected network

Interconnected phases

Interconnected pore structures

Interconnected pore, definition

Interconnected reaction

Interconnected region

Interconnected stirred tank reactors

Interconnected voids

Interconnectibility, multiple

Interconnecting chain

Interconnecting chain segments stretched

Interconnecting pores

Interconnection LaCrO

Interconnection Technology

Interconnection Technology Research

Interconnection Technology Research Institute

Interconnection and packaging

Interconnection delay

Interconnection effects

Interconnection for Electrically Connecting the Cells

Interconnection lanthanum chromite

Interconnection lines

Interconnection materials

Interconnection matrix

Interconnection metal alloys

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Interconnection problem

Interconnection requirements

Interconnection solder-based

Interconnections

Interconnections

Interconnectivity

Interconnects conditions

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Interconnects early developments

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Interconnects oxidation

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Interconnects pitch

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Interconnects rings

Interconnects surface stability

Interconnects, organic

Interconnects, superconductors

Interfacial Compatibility of Glasses and Interconnects

International Standards Organization/Open System Interconnect model

Intrinsic safety interconnections

Ionic conductivity interconnects

Japan interconnection technologies

Lanthanum chromite interconnects

Lanthanum chromite interconnects coatings

Lanthanum chromite, cell interconnects

Lead-Free Solder Interconnect Reliability

Lead-free solder interconnects

Lead-free solder interconnects interfacial interactions

Lead-free solder interconnects thermomechanical reliability prediction

Local interconnect

Local interconnect network

Local tungsten interconnects

Machining applications chip interconnection

Metabolism interconnected reactions

Metal interconnects

Metallic interconnects

Metallic interconnects candidate alloys

Metallic interconnects corrosion

Metallic interconnects perovskites

Metallic interconnects surface stability

Methods of Reducing Interconnect Delay

Model interconnected tubes

Models Open Systems Interconnect

Molded Interconnection Devices

Molded interconnect device

Molding interconnection device(MID

Molecular interconnects

Moulded interconnect devices

Multi process interconnection

Multilayer interconnections

Multilevel interconnections, insulating

Multilevel interconnections, insulating layer

Networking Open Systems Interconnect Model

Neuron interconnections between

On-chip interconnections

Open System Interconnection reference

Open System Interconnection reference model

Open Systems Interconnection

Open Systems Interconnection OSI) model

Optical interconnect technology

Optical interconnections

Optical interconnections advantages

Optical interconnections applications

Optical interconnections fiber optics

Optical interconnects

Optics and Optical Interconnect Technology

Ordered polymers for interconnection

Ordered polymers for interconnection substrates

Oxidation interconnect

Oxide interconnection

Parallel computers processor interconnection

Percolation threshold, interconnected

Percolation threshold, interconnected phase

Peripheral Component Interconnect

Permeability interconnected

Perovskite interconnects

Plant cell-walls interconnections

Plants interconnections

Polyimides interconnections

Polymer-film interconnect

Polymeric materials for electronics packaging and interconnection

Pores interconnected

Precision Interconnect Drilling

Protective Coatings for Ferritic Stainless Steel Interconnects

Ps out diffusion — interconnectivity of pores

RC Delay and New Interconnect Materials

Reliability Concerns of ICA Interconnects

Reliability of ACA Interconnects

Reliability of interconnects with conductive adhesives

Research Association Molded Interconnect

Research Association Molded Interconnect Devices

Rings, interconnect

Risk Profiles of Interconnected Actors

SOFC Interconnect

Semiconductor interconnection fabrication

Silver wire interconnects

Sintering interconnects

Small-scale units interconnection

Solder interconnection levels

Solder-based Interconnection Techniques

Solid oxide fuel cell interconnects

Solid oxide fuel cells cell interconnection

Solid oxide fuel cells interconnection

Stability metallic interconnect surface

Steel alloy interconnects

Steel foil interconnects

System Interconnected

Systems interconnect

Systems of Interconnected Distillation Columns

TUNGSTEN AS INTERCONNECT MATERIAL

The Pectic Polysaccharides are Covalently Interconnected

The damascene process for copper interconnects

Thin film multilayer interconnect packaging

Thin film multilayer interconnects

Thin-film multilayer interconnections

Thin-film multilayer interconnections applications

Transmission line interconnect

Tungsten interconnects

Weaknesses of aluminum interconnects

Zeolite-like Molecular Sieves with Intersecting (or Interconnected) Channels

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