Solder-based Interconnection Techniques

To reduce the thermal stress for components as well as for thermoplastic base substrates, conductive adhesives and selective soldering can be used. In working with adhesives, good interconnections with a maximum temperature of only about lOCfC can be established. This temperature is necessary to harden the epoxy material. In the selective soldering technique, the heat is transferred only to places where interconnections have to be made between the component s termination and the pad on the substrate. This reduces the overall thermal stress situation for the whole 3D MID. 

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