High Density Interconnect Standards

IPC-2226 Design Standard for High Density Interconnecting Structures and Microvias ... 

IPC-6016 Standard for Qualification and Performance Specification for High Density Interconnection Structures ... 

IPC-4104 This standard identifies materials used for high-density interconnection structures. A series of specifications (slash sheets) are defined for specific available materials. Each sheet outlines engineering and performance data for materials used to fabricate high-density interconnecting structures. These materials include dielectric insulator, conductor, and dielectric/conductor combinations. The slash sheets are provided with letters and numbers for identification purposes. For example, if a user wishes to order from a vendor and reference the specification sheet number 1, the number 1 would be substituted for the S ... 

To facilitate the many choices of laminates and their associated properties, industry standards groups such as the IPC have defined minimum performance specifications and have issued several specifications to inform the selection process. Some of the most commonly used material specifications are those that deal with laminate,prepreg, and copper foil. IPC lOl, Specification for Base Materials for Rigid and Multilayer Printed Boards, and IPC-4652, Metal Foil for Printed Wiring Applications, are the primary specifications for clad laminates, prepregs, and foils. Another specification, IPC- 4104, Specification for High Density Interconnect (HDI) and Microvia Materials, deals with many of the new materials for HDI, such as epoxy-coated microfoils, as discussed in this chapter. 

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