High Density Interconnect Microvia material

IPC 4104, Specification for High-Density Interconnect (HDI) and Microvia Materials, 05/99 This document contains specification sheets for materials used in HDI and microvia applications. 

IPC-4104 Standard for Qualification and Conformance of Materials for High Density Interconnection Structures and Microvias ... 

Glass Transition and Modulus of Materials Used in High Density interconnection (HDI) and microvias—DMA method ... 

Glass transition temperature and thermal expansion of materials used in high density interconnection (HDI) and microvias—TMA method Decomposition temperature (Td) of laminate material using TGA Glass transition temperature and cure factor by DSC ... 

To facilitate the many choices of laminates and their associated properties, industry standards groups such as the IPC have defined minimum performance specifications and have issued several specifications to inform the selection process. Some of the most commonly used material specifications are those that deal with laminate,prepreg, and copper foil. IPC lOl, Specification for Base Materials for Rigid and Multilayer Printed Boards, and IPC-4652, Metal Foil for Printed Wiring Applications, are the primary specifications for clad laminates, prepregs, and foils. Another specification, IPC- 4104, Specification for High Density Interconnect (HDI) and Microvia Materials, deals with many of the new materials for HDI, such as epoxy-coated microfoils, as discussed in this chapter. 

IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials... 

For example, the development of high-mesh-coimt screens and microvias in multilayer ceramics has recently allowed for much higher densities of interconnects than was traditionally the case [52-54]. These same technologies also enable the tight tolerance fine lines that are required by high-frequency designers [53-55]. Finally, there has been tremendous activity in the last few years regarding the use of microfluidic and MEMS-based devices based on multilayer ceramic materials [57,58]. 

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