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Interconnection and packaging

MetalFoilforPrinted WiringApplications, IPC-MF-150, Institute for Interconnecting and Packaging Electronic Circuits, Liucolnwood, IU., 1991. [Pg.535]

Interconnection and Packaging of High-Performance Integrated Circuits... [Pg.449]

Chen, H., Acharya, D., Gajraj, A., Meiners, J.-C., Robust interconnects and packaging for microfluidic elastomeric chips. Anal. Chem. 2003, 75, 5287-5291. [Pg.456]

Zschech E, Whelan C, Mikolajick T. Materials for Information Technology Devices, Interconnects and Packaging. Springer 2005. p 461. [Pg.23]

H.B. Bakoglu, Circuits, Interconnections and Packaging for VLSI, Addison-Wesley Pub. Co., Reading, MA (1990). [Pg.33]

S. Krongelb, J. O. Dukovic, M. L. Komsa, S. Mehdizadeh, L. T. Romankiw, P. C. Andricacos, A. T. Pfeiffer, and K. Wong, The Application of Electrodeposition Processes to Advanced Package Fabrication, SPIE International Conference on Advances in Interconnection and Packaging, 1389, 249-256 (1990). [Pg.159]

See other pages where Interconnection and packaging is mentioned: [Pg.59]    [Pg.65]    [Pg.273]    [Pg.276]    [Pg.273]    [Pg.276]    [Pg.329]    [Pg.450]    [Pg.451]    [Pg.453]    [Pg.455]    [Pg.457]    [Pg.459]    [Pg.461]    [Pg.463]    [Pg.465]    [Pg.467]    [Pg.469]    [Pg.471]    [Pg.473]    [Pg.475]    [Pg.477]    [Pg.479]    [Pg.481]    [Pg.483]    [Pg.485]    [Pg.487]    [Pg.489]    [Pg.491]    [Pg.493]    [Pg.495]    [Pg.497]    [Pg.499]    [Pg.501]    [Pg.503]    [Pg.505]    [Pg.507]    [Pg.509]    [Pg.511]    [Pg.261]    [Pg.242]   


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