Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Japan interconnection technologies

Figure 21 shows two prototypes of the monolithic Z-type interconnected modules, fabricated by Aisin Seiki in Japan. Note that carbon is used as a back contact to cut cost. Field tests of such modules already started several years ago and the results of these tests revealed advantages of the DSC with regards to silicon panels under realistic outdoor conditions. Thus, for equal rating under standard test conditions the DSC modules produced 20-30% more energy under real outdoor conditions than the polycrystalfine silicon (pc-Si) modules. A photograph of the test station comparing the two types of photovoltaic technologies is shown in Fig. 22. The superior performance of the DSC can be ascribed to the following factors ... Figure 21 shows two prototypes of the monolithic Z-type interconnected modules, fabricated by Aisin Seiki in Japan. Note that carbon is used as a back contact to cut cost. Field tests of such modules already started several years ago and the results of these tests revealed advantages of the DSC with regards to silicon panels under realistic outdoor conditions. Thus, for equal rating under standard test conditions the DSC modules produced 20-30% more energy under real outdoor conditions than the polycrystalfine silicon (pc-Si) modules. A photograph of the test station comparing the two types of photovoltaic technologies is shown in Fig. 22. The superior performance of the DSC can be ascribed to the following factors ...
Doi T. Details of Semiconductor CMP Technology. Japan 2000. p 61-66. Hoshino S, Uda Y, Yamamoto E. Characteristics of copper CMP process for ultra-low pressure. Ninth International CMP Planarization for ULSI Multilevel Interconnection Conference 2004 Feb 24-26. [Pg.79]

High Density Interconnection Group, Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba Central 2, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568, Japan t.yokoshima aoni.waseda.jp... [Pg.2]

Tsukada, Y. (1997). Japan Institute for Interconnecting and Packaging Electronic Circuits, 2nd symposium on Evaluation Technology, pp. 1-7. [Pg.24]

VIL. The VIL (Victor Interconnected Layers) HDI technology was developed by Victor of Japan. It utilizes FR-4 prepreg materials that are laser-drilled and sequentially laminated after the vias are filled with a conductive paste. Figure 23.26 shows the typical manufacturing sequence for this HDI technology. [Pg.526]

See other pages where Japan interconnection technologies is mentioned: [Pg.198]    [Pg.508]    [Pg.50]    [Pg.35]    [Pg.121]    [Pg.175]    [Pg.469]    [Pg.120]    [Pg.15]   
See also in sourсe #XX -- [ Pg.52 ]



SEARCH



Interconnect

Interconnected

Interconnections

Interconnects

© 2024 chempedia.info