High Density Interconnect Design

Lead-free PCB design and manufacturing techniques Lead-free materials Lead-free reliability models High-Density Interconnection (HDl) best practices... 

IPC-2315 Design Guide for High Density Interconnecting Structures and Microvias ... 

TABLE 64.2 Critical Items in the Design of High-Density Interconnects ... 

L. Chen et al.. Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Rip Chip Interconnection, Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Eailure Analysis (HDP 04), June/July... 

Kivilahti, J.K. Kulojarvi, K. A new reliability aspect related to high density interconnections. Proceedings of the Design and Reliability of Solder Joints, Orlando, PL, 1997 377-384. 

Figure 2.56 shows a variety of stacked cell designs employed by SOFCs. Since an individual fuel cell produces a low voltage (typically < 1V), a number of cells are connected in series forming a fuel cell stack. An interconnect comprising a high-density material is used between the repeating anode-electrolyte-cathode units of... 

As design features are continually reduced to produce higher-density interconnects, tighter control of every step in the conductor formation process is required to achieve high yield. The maximum possible yield with an etching or plating process depends on the conductor dimensions such as the conductor pitch in terms of line and space, the conductor thickness, and the size and shape of the capture pads around plated through-holes (PTH) and vias. 

---