Air-gap interconnects

NakamuraN, Matsunaga N, Kaminatsui T, Watanabe K, Shibata H. Cost-effective air-gap interconnects by all-in-one post-removing process. In Interconnect technology conference, 2008. IITC 2008. International, 1—4 June 2008 2008. p. 193—5. 

Yoo HJ, Balakrishnan S, Bielefeld J, Harmes M, Hiramatsu H, King S, et al. Demonstration of a reliable high-performance and yielding air gap interconnect process. In Interconnect technology conference (IITC), 2010 international, 6—9 June 2010 2010. p. 1—3. 

The Context model is the most abstract level which interconnects the on-board and trackside interfaces through the air gap. The Process level specifies the general communication setup. The Scenario level is used to as a message generator. It sends messages both to the track and to the train. The function models are illustrated on the Movement Authority (MA) example. 

For 10—7 nm nodes more interconnect levels will have air-gaps for enhanced performance. The mechanical integrity of interconnects with a higher number of... 

Figure 2.6 Intel 14 nm interconnects with air-gaps at 52 nm pitch.

Kohl, P. A. Zhao, Q. Patel, K. Schmidt, D. Bidstrup-Allen, S. A. Shick, R. Jayaraman, S. Air-gaps for electrical interconnections. Electrochem. Solid-State Lett. 1998,1, 49-51. 

A better way of achieving a complete 3D photonic band gap is considered to be by constructing a lattice of air balls surrounded by an interconnecting matrix of material with a higher refractive index. The successful construction of such crystals by growth techniques is unlikely and likewise the build up by deposition techniques is no simple procedure. 

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