Molding interconnection device MID

Manufacturers of three-dimensional circuits prefer to call them molded interconnection devices (MIDs).In many apphcations of MIDs,the number of components to interconnect the electronic and electrical components can be reduced, thus making the total assembly cost cheaper and the final structure more rehable. 

Brose, A., Leneke, T., Hirsch, S, Schmidt, B. Aerosol Deposition of Catalytic Ink to Fabricate Fine Pitch Metallizations for Molded Interconnect Devices (MID). 

A molded interconnect device (MID) is an injection-molded thermoplastic part with structured circuit traces. This definition still applies, although the term 3D-MID has also become common. An extension of the meaning to mechatronic integrated device, moreover, allows for the fact that thermoplastics are not the only materials used, and MID are not necessarily produced by injection molding. 

The use of thermoplastics and their selective metal plating opens a new dimension in circuit carrier design to the electronics industry 3D molded interconnect devices (3D MIDs). MIDs are injection-molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer remarkably improved ecological behavior in comparison to conventional printed circuit boards which they wiU, however, complement, not replace. 

Recently, MID (Molded Interconnection Device) technology was introduced by utilizing LCPs characteristics to its fullest. MID is a concept which can eliminate metal lead frame and metal contact pin on electronic devices by plastic metalization. This new technology contributes to miniaturization and reliability increase for various electronic devices. 

A handful of three-dimensional molded circuit manufacturers (or, the preferred identification, molded interconnection device or MID) have continued their quest for market with this... 

An extreme example for short-term peak temperatures is the soldering process. Soldering temperature resistance of circuit boards is defined by several standards with corresponding testing methods. However, they cannot be meaningfully applied to injection molded circuitry (MID Molded Interconnect Device). 

Radiation cross-linking of engineering thermoplastics for MID applications, 6. International Congress Molded Interconnected Devices, Erlangen, 2004, p. 139- 146... 

MID is the abbreviation for molded interconnect device. On account of the versatility of the injection molding process and with structured metallization, mechanical and electrical functions can be integrated directly into MID parts, as can optical, fluidic, or thermal functions, among others. Widely differing processes can be employed for manufacturing the basic body and for applying or building the conductive structures. The root principle is illustrated in Fig. 1.1. 

Network-Oriented Cooperation within the Research Association Molded Interconnect Devices (3-D MID)... 

However, the reiativeiy high price of TCP remains a motivator for the development and production of new high-performance materials so that MID suitable for lead-free soldering can still be produced economically. The thermoset, moldable compounds that are not yet the accepted state of the art in MID technology have properties profiles that appear to offer more than enough points of departure for use as substrate materials for molded Interconnect devices. 

Atotech s 3D-MID Plating Equipment and Chemistry - A Great Synergy for Molded Interconnect Devices... 

Amend, P. et al. ADDIMID Technology and Aerosol Jet Printing for Functional MID Prototypes by the Use of Stereolithography. In Proceedings 10th International Congress Molded Interconnect Devices, Research Association Molded Interconnect Devices 3-D MID e. V., Fiirth, 19-20 September 2012. 

Kaiser, 1. Systematik zur Entwicklung mecbatroniscber Systeme in der Tecbnologie MID (Molded Interconnect Devices), Heinz Nixdorf Institut, Universitat Paderbom, HNl-Verlagsscbriftenreibe, Vol. 248, Paderborn, 2009. 

Research Association Molded Interconnect Devices 3-D MID e. V., Fiirth,... 

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