Current-Carrying Capacity and Interconnect Resistance

Other characteristics of electrical interconnects are current-carrying capacity and interconnect re sistance. Current-carrying capacity is important forthe qualification of adhesives for flip-chip interconnects. Typical current densities for conductive epoxies used as flip-chip bumps are 10-20 amps/ mm and typical bump resistances are 12 mQ. [Pg.409]

No standard test method exists forthese tests. According to the general guidelines of IPC-3406,1 1 junction resistance shall be measured before and after performing the IPC aging tests on all surface materials that come in [Pg.409]

The main electrical properties related to organic materials are volume resistivity (for both conductive and nonconductive adhesives) and dielectric constant and dissipation factor (for insulative materials). Other electrical tests for conductive materials that are more application specific are electrical stability, current-carrying capacity, and interconnect resistance. [Pg.355]

We have already indicated in [2], that such interconnects outclass conventional copper metallization at this reduced dimension with respect to electrical resistance and current carrying capacity. [Pg.528]