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Copper interconnects for ceramic substrates

Figure 20. Multichip test vehicle for submicrometer bipolar ICs. The vehicle contains Jive metal layers of copper-polyimide interconnections on a pinned cofired ceramic substrate (3 by 3 in. [7,6 by 7.6 cm]) (Reproduced with permission from reference 79. Copyright 1988 Materials Research Society.)... Figure 20. Multichip test vehicle for submicrometer bipolar ICs. The vehicle contains Jive metal layers of copper-polyimide interconnections on a pinned cofired ceramic substrate (3 by 3 in. [7,6 by 7.6 cm]) (Reproduced with permission from reference 79. Copyright 1988 Materials Research Society.)...
Figure 23. Multichip package for a supercomputer. Top, unpopulated substrate with TFML copper-polyimide interconnections on a 100 by 100 mm multilayer ceramic substrate bottom, cross section of interconnection structure and flip-TAB carrier. (Reproduced with permission from reference 81. Copyright 1985 Institute of Electrical and Electronics Engineers.)... Figure 23. Multichip package for a supercomputer. Top, unpopulated substrate with TFML copper-polyimide interconnections on a 100 by 100 mm multilayer ceramic substrate bottom, cross section of interconnection structure and flip-TAB carrier. (Reproduced with permission from reference 81. Copyright 1985 Institute of Electrical and Electronics Engineers.)...
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Ceramic interconnects

Ceramic substrate

Copper interconnect

Copper interconnects

Interconnect

Interconnect substrates

Interconnected

Interconnections

Interconnects

Substrate copper

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