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Interconnects, organic

The sol-gel process can be viewed most simply as a series of two reactions (usually hydrolysis and then condensation) where at first the reactants form small particles in a solvent and then condense fiirther to form a gel. Simple alkylsilanes and especially silicic acid esters are often crucial in these reactions as they are the raw materials in this process. Organofiinctional silanes have the additional feature in that they can interconnect organic resins with the inorganic part of these... [Pg.574]

Figure 24.2 Nanostructure of bicontinuous nanocomposites. Top Pictorial description of interconnected organic and inorganic domains with gradient density interphase. Bottom TEM micrograph of an epoxy/silica bicontinuous nanocomposite. Figure 24.2 Nanostructure of bicontinuous nanocomposites. Top Pictorial description of interconnected organic and inorganic domains with gradient density interphase. Bottom TEM micrograph of an epoxy/silica bicontinuous nanocomposite.
Liu, Y., Bristow, J., Marta, T., Bounnak, S., Johnson, K., Liu, Y., and Cole, H., Polymer waveguide applications in multichip modules (MCMs) and board level optical interconnects. Organic thin films for photonics applications, OSA Tech. Digest Sen, 21, 14 (1995). [Pg.586]

Morikawa et al. (79) later prepared poly(imide)-silica hybrids using polyamic acids synthesized from PMDA, ODA and other diamines. These diamines contained hydrolizable functions, enabling the formation of a chemically interconnected organic/inorganic network. In a sol-gel reaction with TEOS these PAA s formed transparent materials over a wide range of silica compositions. SEM micrographs indicated a silica domain size of 1 to 1.5 microns. [Pg.395]

Abbreviated from International Standards Organization-Open System Interconnection. They are the physical, data link, network, transports session, presentation, and application layers. Only the physical, data link, and application layers are present in the mini-MAP. [Pg.774]

Declare the intention to achieve the organization s objectives through a managed system of interconnected processes. [Pg.94]

Researchers in Japan have determined that copper interconnects deposited by metallo-organic chemical vapor deposition (MOCVD), then followed by chemical mechanical polishing, provides sub-quarter-micron interconnects and can be achieved on a production basis. Titanium nitride and borophosphosilicate glass provide effective barriers against copper diffusion.PL[H]... [Pg.371]

TI4SCI4 and T SeCh melt at 440 and 442°C, respectively. They can be distilled between 650 and 700°C without decomposition. They are insoluble in H2O and organic solvents, but soluble in aqueous alkaline solutions. With cone, acids, decomposition takes place. The electric conductivity has been determined to be 1.4-10 and 2.1-10 fl cm for TI4SCI4 and TUSeCU, respectively. The probable structural formula is Tl3(TlCl4Y). The compounds thus, presumably, consist of Tli,4Cl4,4Y2/8 octahedra that are interconnected by the chalcogen atoms to linear chains (321). [Pg.389]

A neural network consists of many neurons organized into a structure called the network architecture. Although there are many possible network architectures, one of the most popular and successful is the multilayer perceptron (MLP) network. This consists of identical neurons all interconnected and organized in layers, with those in one layer connected to those in the next layer so that the outputs in one layer become the inputs in the subsequent... [Pg.688]


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See also in sourсe #XX -- [ Pg.77 ]




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