High Density Interconnect Fabrication

IPC-4104 This standard identifies materials used for high-density interconnection structures. A series of specifications (slash sheets) are defined for specific available materials. Each sheet outlines engineering and performance data for materials used to fabricate high-density interconnecting structures. These materials include dielectric insulator, conductor, and dielectric/conductor combinations. The slash sheets are provided with letters and numbers for identification purposes. For example, if a user wishes to order from a vendor and reference the specification sheet number 1, the number 1 would be substituted for the S ... 

Two challenges are uniform thinning of the top wafer and high aspect ratio etching of the thinned layer. An approach to high-density TSV interconnection using a variety of CMOS-compatible fabrication steps (such as CVD tungsten and polysilicon, BCD copper, and solder micro-bumps) is presented by Knickerbocker et al. in References 86 and 87. 

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