Molded interconnect device

The use of thermoplastics and their selective metal plating opens a new dimension in circuit carrier design to the electronics industry 3D molded interconnect devices (3D MIDs). MIDs are injection-molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer remarkably improved ecological behavior in comparison to conventional printed circuit boards which they wiU, however, complement, not replace. 

Recently, MID (Molded Interconnection Device) technology was introduced by utilizing LCPs characteristics to its fullest. MID is a concept which can eliminate metal lead frame and metal contact pin on electronic devices by plastic metalization. This new technology contributes to miniaturization and reliability increase for various electronic devices. 

Manufacturers of three-dimensional circuits prefer to call them molded interconnection devices (MIDs).In many apphcations of MIDs,the number of components to interconnect the electronic and electrical components can be reduced, thus making the total assembly cost cheaper and the final structure more rehable. 

A handful of three-dimensional molded circuit manufacturers (or, the preferred identification, molded interconnection device or MID) have continued their quest for market with this... 

An extreme example for short-term peak temperatures is the soldering process. Soldering temperature resistance of circuit boards is defined by several standards with corresponding testing methods. However, they cannot be meaningfully applied to injection molded circuitry (MID Molded Interconnect Device). 

Radiation cross-linking of engineering thermoplastics for MID applications, 6. International Congress Molded Interconnected Devices, Erlangen, 2004, p. 139- 146... 

Members of the Research Association Molded Interconnect Devices... 

MID is the abbreviation for molded interconnect device. On account of the versatility of the injection molding process and with structured metallization, mechanical and electrical functions can be integrated directly into MID parts, as can optical, fluidic, or thermal functions, among others. Widely differing processes can be employed for manufacturing the basic body and for applying or building the conductive structures. The root principle is illustrated in Fig. 1.1. 

Of the many thermal characteristic values measurable for polymers, two that are highly relevant for molded interconnect devices are glass transition temperature (for amorphous and partially crystalhne thermoplastics) and melting temperature Tu (for partially crystalline thermoplastics). They can be determined by dynamic mechanical analysis (DMA) or differential scanning calorimetry (DSC). Other characteristic properties of primary importance are (short-term and long-term) service temperature and heat deflection temperature, as are temperature response and heat conductivity and the thermal expansion of the thermoplastic substrate materials. 

However, the reiativeiy high price of TCP remains a motivator for the development and production of new high-performance materials so that MID suitable for lead-free soldering can still be produced economically. The thermoset, moldable compounds that are not yet the accepted state of the art in MID technology have properties profiles that appear to offer more than enough points of departure for use as substrate materials for molded Interconnect devices. 

Atotech s 3D-MID Plating Equipment and Chemistry - A Great Synergy for Molded Interconnect Devices... 

Another research project examined the reliability of press-in connections as a viable alternative connection technique for injection-molded interconnect devices. Unlike the project outlined above, in which the test program and selected methods were tailored to the object of examination, a test program set out in DIN EN 60352 Part 5 was definitive for qualification of the reliability of press-in pins. See Fig. 6.18. The test program is subdivided here into an assessment program for basic qualification of individual connections and an application program for checking connections that are part of a component/parent system. 

Design rules The guideline supplies very specific design rules that assist developers in designing molded interconnect devices. Recommended conductor widths and spacing are explained, along with edge radii and conductor positions. 

MIDIA Molded Interconnect Devices International Association... 

Amend, P. et al. ADDIMID Technology and Aerosol Jet Printing for Functional MID Prototypes by the Use of Stereolithography. In Proceedings 10th International Congress Molded Interconnect Devices, Research Association Molded Interconnect Devices 3-D MID e. V., Fiirth, 19-20 September 2012. 

Brose, A., Leneke, T., Hirsch, S, Schmidt, B. Aerosol Deposition of Catalytic Ink to Fabricate Fine Pitch Metallizations for Molded Interconnect Devices (MID). 

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