Electrical interconnects

Metal is then deposited into the opened vias (openings) in the oxide layer and over its surface. During the subsequent photolithography process, it is patterned to form the desired electrical interconnections. These two steps are repeated for each succeeding level to produce additional levels of interconnections. Finally, a protective overcoat of oxide/nitride is applied (passivation), and vias are opened so that the wires eonnectlng the IC chip to its carrier package can be bonded to output pads. 

Fike, S. M. Buchanan, B. Jokerst, N. M. Brooke, M. A. Morris,T. G. DeWeerth, S. P. 1995. 8 x 8 array of thin-film photodetectors vertically electrically interconnected to silicon circuitry. Photonics Technol. Lett., IEEE 7 1168-1170. 

The membranes of the microhotplates were released by anisotropic, wet-chemical etching in KOH. In order to fabricate defined Si-islands that serve as heat spreaders of the microhotplate, an electrochemical etch stop (ECE) technique using a 4-electrode configuration was applied [109]. ECE on fully processed CMOS wafers requires, that aU reticles on the wafers are electrically interconnected to provide distributed biasing to the n-well regions and the substrate from two contact pads [1 lOj. The formation of the contact pads and the reticle interconnection requires a special photolithographic process flow in the CMOS process, but no additional non-standard processes. 

Tanktrucks, where flammable vapors are likely to be present, should be electrically bonded via the downspout, piping or steel loading rack as shown in Figure 8-13 (API 2003, 1998). If the bonding occurs through the rack, then the downspout, piping, and rack must be electrically interconnected. The connection should be made before the dome cover is opened and remain in place until the dome cover is closed. 

Cells are then individually sorted and classified according to their illuminated electrical parameters and are electrically interconnected in strings, which are then encapsulated to form a module, which is designed to be weather proof and produce electrical output for more than 25 years. 

The tin oxide thin film was patterned by reactive ion etching (RIE) using either SiCl or 1% H2 in N2 as the etch gas. The polysilicon contact holes were opened by wet-chemical etching in buffered hydrofluoric acid (BHF). A double-layer metallization (Cr -50 nm plus A1 -1 pm) was done by electron beam evaporation to form the electrical interconnection (Figure 1c). 

Fluidic and Electrical Interconnects - Device-to-device and Device-to-world 523... 

Reactor 7 [R 7] Electrical Interconnect for Fluid Driving - Chip-to-world... 

In certain applications, such as in the electrical and electronic industries, adhesive systems must have a degree of electrical and/or thermal conductivity. Electrical conductivity is, of course, important in adhesives that must make electrical interconnection between components and in adhesives that must provide electromagnetic or radio-frequency interference (EMI and RFI) functions. 

Because of its high refractive index n 3.7 (Berger et al., 1981), a-Si H lends itself as a conveyor of optical information to light sensitive detectors incorporated in integrated circuits. In this application as an optical waveguide, an optical signal can be transmitted to various circuit components without cross-talk with signals in electrical interconnections. 

An integrated circuit is a multilayer, three-dimensional structure of electrically interconnected solid-state circuit elements isolated with patterned dielectric films. The dielectric, conductor, and semiconductor films are deposited or formed by sophisticated chemical reactions. The successful growth and manipulation of these films depend heavily on the proper design of chemical reactors used in deposition and etching, the choice of appropriate chemical reagents, separation and ultrapurification, and operation of sophisticated control systems. 

The ability to integrate an electro-optic material with other optical devices, e.g. light sources and detectors, and with electronic drive circuits is important. Integrability implies that the electro-optic materials and the processing of these materials are compatible with the other components, and that electrical and optical interconnects can be fabricated. Polymer glasses are widely used in the fabrication of electronic devices and device interconnects. Polymers are also used as photoresists and as dielectric interlayers for electrical interconnects. As a result, a body of knowledge already exists concerning planarization methods of polymers on substrates, the definition of microscopic features, and the fabrication of microstructures in planar polymer structures. 

Computers, microprocessors, and other microelectronic devices could not exist as we know them today without the technology of depositing thin metal or alloy films with fine lithographic patterns. For example, in a computer, the individual transistors that make up an integrated circuit must be electrically interconnected by a complex network of conducting lines and vias that are deposited above the semiconductor layers. Furthermore, the chips are joined to multi-chip packaging modules, a process in which many electrical connections are simultaneously established by solder balls. 

Since Scandinavia is electrically interconnected, variations in rainfall in Norway and Sweden lead to large variations in Danish electricity imports and exports. Danish energy statistics therefore operate with corrected as well as actual emissions. The corrected emissions are calculated using zero electricity exchange as a basis. 

In the formation of microcircuits, electrically interconnected films laid down by chemical reactions (.see Section 12,10). One method by wl these films are made is chemical vapor deposition. 

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