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Machining applications chip interconnection

The most often discussed application of SPAs is optical interconnection. All applications of these arrays involve optical interconnection in one way or another, but the term optical interconnection most often refers to optical data channels between electronic processors and devices. This includes data transfer between machines, racks, boards, and chips. SPAs are being developed for optical interconnection at the board and chip level where the demand is very high for the dense packaging of the electronic and optical devices. Figure 2 illustrates two of several envisioned configurations for board-to-board and chip-to-chip optical interconnection. [Pg.280]


See other pages where Machining applications chip interconnection is mentioned: [Pg.308]    [Pg.5]    [Pg.308]    [Pg.109]    [Pg.17]    [Pg.46]    [Pg.480]    [Pg.111]    [Pg.289]    [Pg.292]    [Pg.429]   
See also in sourсe #XX -- [ Pg.172 ]




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