Glass/interconnect interface

Alkali Metal-Based Glasses/Interconnects Interface... 

Barium-Calcium-Magnesium-Strontium Glasses/ Interconnect Interface... 

Besides the glass seal interfaces, interactions have also been reported at the interfaces of the metallic interconnect with electrical contact layers, which are inserted between the cathode and the interconnect to minimize interfacial electrical resistance and facilitate stack assembly. For example, perovskites that are typically used for cathodes and considered as potential contact materials have been reported to react with interconnect alloys. Reaction between manganites- and chromia-forming alloys lead to formation of a manganese-containing spinel interlayer that appears to help minimize the contact ASR [219,220], Sr in the perovskite conductive oxides can react with the chromia scale on alloys to form SrCr04 [219,221],... 

In investigations of the failure of fiber compositions (PETP — short glass fibers) [251] it was found that the main process responsible for composite failure under load is the rupture at the matrix-fiber interface. The author of [251] observed formation of microvoids in loaded samples, both at the interphases and in the bulk. The microvoids, or cavities) grow in size and become interconnected by microcracks, and this results in fiber separation from the binder. However, when the matrix-fiber bond is strong enough, the cavities appear mostly in the bulk of matrix, the failure of the specimen does not over-power cohesion and traces of polymer remain on the fibers. 

In addition to the aforementioned interactions with the surrounding gas environments, metallic interconnects also interact with adjacent components at their interfaces, potentially causing degradation of metallic interconnects and affecting the stability of the interfaces. One typical example is the rigid glass-ceramic seals, in particular those made from barium-calcium-aluminosilicate (BCAS) base glasses [205-209], FSS interconnect candidates have been shown to react extensively with... 

Many barium aluminosilicate-based compositions will eventually react with the chromium oxide or aluminum oxide scales on the metal interconnect or metal edge rails to form barium chromate or a celsian phase at the interface [6], This can cause a mechanical weakness that is easily delaminated. Also, compositions that contain boron can react over time with water (steam) to produce B2(OH)2 or B(OH)3 gas. This can decompose the glass and greatly limit the lifetime of the seal. Thus many of the new investigations have emphasized low or no boron glass compositions. 

An interface or housing for micro fluidic applications was designed and fabricated. The device, made of PEEK, allows facile non-permanent coupling of standard capillary tubing to silicon/glass micro mixer chips. No additional adhesive material was used to for a secure and tight interconnect [70],... 

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