Coatings on Interconnect

7 Mixed Alkaline/Composite Glasses and Coated Interconnects 

The polarisation part contributes mainly to the impedance part The ohmic resistances increased a few milliohms within the first 500 h and then remained almost constant. The conductivity of Cr203 is almost 10 -10 S/cm at 800°C and by the end of the stack degradation test, the Cr scale is almost 5 pm. For an interconnect plate of area 25 cm and oxide scale 5 pm thick, an increase in ohmic resistance up to 10-100 mfl could be expected. The cathode side of (Mn, Co) spinel-coated interconnect plate might contribute to the ohmic resistance. 

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In planar SOFCs, individual cathode, anode, and electrolyte layers have been deposited by PS [109-111], as well as coatings on interconnect materials and full cells [108, 110, 112]. In addition to the interconnect layers themselves in tubular SOFCs, dense protective layers with good adhesion have also been deposited to protect planar SOFC interconnects from oxidation [110], and diffusion barriers to inhibit inter-diffusion between the interconnects and anodes have been produced by PS [113]. 

The most effective use of PIQ in semiconductors is as an insulating layer for multilevel interconnections. After the first metallization is formed, a PIQ prepolymer solution is spin coated on the wafer and then thermally cured. 

The object of semiconductor lithography is to transfer patterns of ICs drawn on the mask or reticle to the semiconductor wafer substrate. The transfer is carried out by projecting the image of the reticle with the aid of appropriate optical elements of an exposure tool onto a radiation-sensitive resist material coated on the semiconductor wafer, typically made of silicon, and stepping the imaging field across the entire wafer to complete a layer. The shape of the IC pattern transferred to the wafer substrate is dependent entirely on the wafer layer being patterned. Examples of patterns include gates, isolation trenches, contacts, metal interconnects, and vias to interconnect metal layers. An advanced CMOS (complementary... 

Demonstration of the creation of multilayer line structures in the seal will result in the collection of physical measurement data on the change in seal features during heat up, steady state operation, transients, or on cool down. A radar type image of the signal characteristics will show build up or relaxation of stresses, discontinuities in seal structure including porosity, delamination of the seal from either the cell or interconnect, and ultimately the catastrophic failure of the seal. Additionally with the ability to use a metal interconnect as one of the plane references coupled with a trace on the oxide coating on the interconnect, electrical conductivity and structural integrity of the thin oxide film on the metal interconnect can be determined within the vicinity of the trace. 

E.M. Garcia et al, "Electrochemical Recycling of Cobalt from Spent Cathodes of Lithium-ion Batteries Its Application as Coating on SOFC Interconnects," Journal of Applied Electrochemistry, Vol 41, 11, 2011, 1373-1379. 

Figure 12.6 SEM of NSN-scaffolds showing nanofiber networks pervading the interconnected pore spaces (a) and collagen coating on the microfibrous structures (b).

Yang Z, Xia GG, Maupin GD, Stevenson JW (2006) Evaluation of perovskite overlay coatings on ferritic stainless steels for SOFC interconnect applications. J Electrochem Soc 153 A852-A1858... 

This paper will outline performance validation testing that has been completed on the MCO coating to evaluate oxidation and chromium volatilization resistance that limit the service lifetime of coated metallic interconnects. 

The PCB physical form should match the intended design. The dimensions and placement position of the interconnection points along with the quality of the coating on these interconnection points mnst be acceptable and of high qnality to facilitate the attachment of components. 

One alternative to the electroless process utilizes conductive polymers. Polymer thick film (PTF) technology is a method of screening polymer conductors, resistors, dielectrics, and protective coatings on a substrate or printed wire board to create basic circuitry or interconnections. The use of screened-on conductive films in place of the formaldehyde-containing electroless copper process is gaining acceptance in Asia (more so than in the United States at this time). 

Zawadzak et al. have considered the development of new tissue engineering scaffolds based on highly porous and interconnected PU foams electrophoretically coated with carbon nanotubes (Zawadzak et al., 2009). These authors observed that the presence of a uniform CNT coating on the surface of PU foams accelerated the formation of calcium phosphate, an indication of the material effectiveness to form strong bonds to bone tissue, when compared to the uncoated foams, which was related to favored calcium phosphate crystal nucleation and growth induced... 

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