High Density Interconnect Materials

Cole HS, Gorowitz B, Gorczyca T, Wojnarowski R, Lupinski J (1992) Polymeric materials requirements for the GE high-density interconnect process. Mater Res Soc Symp Proc 264 (Electronic Packaging Materials Science VI) 43... 

Wang, Y.L., Olliver, P.J., and Skurski, M.A., Photoformed materials and their applications in fine feature circuitry, Proceedings of High Density Interconnect and Packaging, Denver, CO, April 2000, pp. 579-584. 

Lead-free PCB design and manufacturing techniques Lead-free materials Lead-free reliability models High-Density Interconnection (HDl) best practices... 

IPC 4104, Specification for High-Density Interconnect (HDI) and Microvia Materials, 05/99 This document contains specification sheets for materials used in HDI and microvia applications. 

IPC-4104 Standard for Qualification and Conformance of Materials for High Density Interconnection Structures and Microvias ... 

IPC-4104 This standard identifies materials used for high-density interconnection structures. A series of specifications (slash sheets) are defined for specific available materials. Each sheet outlines engineering and performance data for materials used to fabricate high-density interconnecting structures. These materials include dielectric insulator, conductor, and dielectric/conductor combinations. The slash sheets are provided with letters and numbers for identification purposes. For example, if a user wishes to order from a vendor and reference the specification sheet number 1, the number 1 would be substituted for the S ... 

The Structure of the high-density interconnection is by type Type I,Type II,Type III,Type IV, Type V, and Type VI (see Table 22.2). However, some of these type constructions are based on which micro via material is to be used. Thus, the following definition applies to all high-density interconnect substrates (HDIS). 

Glass Transition and Modulus of Materials Used in High Density interconnection (HDI) and microvias—DMA method ... 

Glass transition temperature and thermal expansion of materials used in high density interconnection (HDI) and microvias—TMA method Decomposition temperature (Td) of laminate material using TGA Glass transition temperature and cure factor by DSC ... 

To facilitate the many choices of laminates and their associated properties, industry standards groups such as the IPC have defined minimum performance specifications and have issued several specifications to inform the selection process. Some of the most commonly used material specifications are those that deal with laminate,prepreg, and copper foil. IPC lOl, Specification for Base Materials for Rigid and Multilayer Printed Boards, and IPC-4652, Metal Foil for Printed Wiring Applications, are the primary specifications for clad laminates, prepregs, and foils. Another specification, IPC- 4104, Specification for High Density Interconnect (HDI) and Microvia Materials, deals with many of the new materials for HDI, such as epoxy-coated microfoils, as discussed in this chapter. 

It seems to be an impossibility to require accurate dimensions on an unstable, thin, flexible material. However, high-density interconnects in particular demand very high accuracy in the termination area of the circuits, even though the dimensional allowance is smaller than the dimensional stability of flexible substrate materials.Therefore, high-accuracy 2-D or 3-D dimension measurement technologies are required. 

IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials... 

PolyHIPE materials possess many peculiar properties as a result of their unique cellular structure. Referring specifically to open-cell polymers (which have received the most attention in the literature), they are characterised by a very low dry bulk density, typically less than 0.1 gem-3, due to their highly porous, interconnected structure. 

High-density, thin-film-based interconnections are a rapidly emerging technology with a number of different material and process options. These materials and processes, as well as recently reported demonstrations of TFML technology, are discussed in more detail in the following sections. 

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