Ceramic interconnect technology

Table 1.4 summarizes the major application/market segment and the technical attributes that influence the selection of ceramic interconnect technology in that segment. As shown in this table, thermal management — thermal performance, thermal stability, and high-temperature operation as it relates to both operating environment and lead-free assembly — is common to most applications. High-performance electrical property, and the related interconnect density, direct die attach, and embedded passives or embedded functions also span many applications. This comparison demonstrates that many... 

Ceramic interconnect technologies are capable of integrating various components, such as passive components, RF/microwave devices, ICs, and transmission lines on and/or in a ceramic substrate, forming electronic modules that provide certain functions. Recently, millions of such functional modules have been commercialized in the automotive industry, consumer... 

Test instruments have long used ceramic interconnect technologies for the capabilities of high-frequency performance and dimensional and environmental stability. Component and interconnection density is also important in those applications where parasitics must be minimized, such as in oscilloscope front ends and probes. Figure 1.32 and Figure 1.33 present some high-performance instrumentation applications of ceramics. 

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