Assembly process Interconnect method

Conventional solder procedures require the use of high-temperature thermoplastics. Other plastics can be processed using low-melting-point solders, conductive adhesives, or selective soldering methods. Available assembly and interconnection technologies as well as processes for the production of the circuit carriers must be carefully considered, selected, and possibly modified to the specific MID materials. 

One-dimensional (ID) nanostructures such as nanowires, nanorods and nanobelts, provide good models to investigate the dependence of electronic transport, optical, mechanical and other properties on size confinement and dimensionality. Nanowires are likely to play a crucial role as interconnects and active components in nanoscale devices. An important aspect of nanowires relates to the assembly of individual atoms into such unique ID nanostructures in a controlled fashion. Excellent chemical methods have been developed for generating zero-dimensional nanostructures (nanocrystals or quantum dots) with controlled sizes and from a wide range of materials (see earlier chapters of this book). The synthesis of nanowires with controlled composition, size, purity and crystallinity, requires a proper understanding of the nucleation and growth processes at the nanometer regime. 

This method allows independent control over both the macropores, which are determined by the emulsion droplets in the first step of the process, and the mesopores, by the supramolecular self-assembly in the second step. Therefore, the two templating systems do not interfere vhth each other, and consequently the meso-and macro-structures can be optimized separately [21]. Inorganic oxides, such as silica, titania and zirconia, were obtained by this two-step process. The bimodal distribution of pores was characterized by highly ordered mesopores (5-10 nm) and by interconnected macropores (0.1 to 5 p,m). These materials possess high pore volumes (17 cm g ) and specific surface areas, as determined by the BET method applied to the nitrogen adsorption isotherm, of between 250 and 750 The... 

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