Interconnects contact materials

Besides the glass seal interfaces, interactions have also been reported at the interfaces of the metallic interconnect with electrical contact layers, which are inserted between the cathode and the interconnect to minimize interfacial electrical resistance and facilitate stack assembly. For example, perovskites that are typically used for cathodes and considered as potential contact materials have been reported to react with interconnect alloys. Reaction between manganites- and chromia-forming alloys lead to formation of a manganese-containing spinel interlayer that appears to help minimize the contact ASR [219,220], Sr in the perovskite conductive oxides can react with the chromia scale on alloys to form SrCr04 [219,221],... 

The CORE-SOFC Project was designed to improve the durability of planar SOFC systems to a level acceptable for commercial operation. The work focuses mainly on materials selection for interconnects, contact layers and protective coatings to minimise corrosion between metallic and ceramic parts to achieve reliable and thermally-cyclable SOFCs. In all work packages, cells and stacks will be analysed by advanced chemical and ceramographic methods. 

Metallic materials for be used as interconnects in SOFCs should fulfil a number of specific requirements [1, 2], Crucial properties of the materials are high oxidation resistance in both air and anode environment, low electrical resistance of the oxide scales formed on the alloy surface as well as good compatibility with the contact materials. Additionally, the value of the coefficient of thermal expansion (CTE) should match with those of the other cell components [3], These requirements can potentially be achieved with high chromium ferritic steels [4], however, previous studies [5] have shown that none of the commercially available ferritic steels seems to possess the suitable combination of properties required for long term reliable cell performance. 

Blood-contacting materials have to fulfill particular requirements, as they are immediately exposed to all host defense mechanisms of the body. Thus, the contact of blood with foreign surfaces induces several cascade reactions and activation phenomena. These complex and highly interconnected reactions potentially create clinically significant side effects in the application of medical devices (e.g., cardiovascular implants, extracorporeal circulation, catheters) and interfere with the success of the medical treatments [64]. In certain cases, even the formation of thromboemboli or systemic inflammatory reactions were reported to occur as a consequence of the activation of coagulation enzymes and thrombocytes and/or the activation of the complement system and leukocytes (immune response) at the biointerfaces of the applied materials [65]. 

These electrodes are usually made from particulate materials which are partially sintered to form porous conducting layers. Often, several layers are laid down because this allows a gradient of properties ranging from nearly pure YSZ at the electrolyte surface to almost pure electrode composition at the interconnect contact, as illustrated in Figure 1.5 for a typical anode structure. In addition the expansion coefficients can then be better matched across the layers. 

In this chapter the requirements of interconnect materials, the characteristics that the leading candidate materials possess, and how well these fulfil the requirements are discussed. The oxide ceramic materials are discussed first followed by a description of several types of metallic interconnection materials. Then, the special protective and contact materials applied as coatings on the interconnects to match them to the electrodes are described. 

Protective Coatings and Contact Materials for Metallic Interconnects... 

Wire Interconnect Materials. Wire-bonding is accompHshed by bringing the two conductors to be joined into such intimate contact that the atoms of the materials interdiffuse (2). Wire is a fundamental element of interconnection, providing electrical connection between first-level (ie, the chip or die) and second-level (ie, the chip carrier, or the leadframe in a single-chip carrier) packages. 

Most battery electrodes are porous stmctures in which an interconnected matrix of soHd particles, consisting of both nonconductive and electronically conductive materials, is filled with electrolyte. When the active mass is nonconducting, conductive materials, usually carbon or metallic powders, are added to provide electronic contact to the active mass. The soHds occupy 50% to 70% of the volume of a typical porous battery electrode. Most battery electrode stmctures do not have a well defined planar surface but have a complex surface extending throughout the volume of the porous electrode. MacroscopicaHy, the porous electrode behaves as a homogeneous unit. 

Multiple feeds to Eliminate interconnections single machine,, Interlock feed valves so only one can be open two feeds open at once. Incompati- 1 " three-way valve ble materials come Implement appropriate operating procedures in contact, possi- and training bly leading to runaway reaction. CCPS G-f5 CCPS G-32... 

Interconnect. Three-dimensional structures require interconnections between the various levels. This is achieved by small, high aspect-ratio holes that provide electrical contact. These holes include the contact fills which connect the semiconductor silicon area of the device to the first-level metal, and the via holes which connect the first level metal to the second and subsequent metal levels (see Fig. 13.1). The interconnect presents a major fabrication challenge since these high-aspect holes, which may be as small as 0.25 im across, must be completely filled with a diffusion barrier material (such as CVD titanium nitride) and a conductor metal such as CVD tungsten. The ability to fill the interconnects is a major factor in selecting a thin-film deposition process. 

The interconnect material is in contact with both electrodes at elevated temperatures, so chemical compatibility with other fuel cell components is important. Although, direct reaction of lanthanum chromite based materials with other components is typically not a major problem [2], reaction between calcium-doped lanthanum chromite and YSZ has been observed [20-24], but can be minimized by application of an interlayer to prevent calcium migration [25], Strontium doping, rather than calcium doping, tends to improve the resistance to reaction [26], but reaction can occur with strontium doping, especially if SrCr04 forms on the interconnect [27],... 

One of the most common ways to characterize the hydrophobicity (or hydrophilicity) of a material is through measurement of the contact angle, which is the angle between the liquid-gas interface and the solid surface measured at the triple point at which all three phases interconnect. The two most popular techniques to measure contact angles for diffusion layers are the sessile drop method and the capillary rise method (or Wihelmy method) [9,192]. 

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