Ceramic interconnects processing

Ceramic boards are currently widely used in high-performance electronic modules as interconnection substrates. They are processed from conventional ceramic precursors and refractory metal precursors and are subsequently fired to the final shape. This is largely an art a much better fundamental understanding of the materials and chemical processes will be required if low-cost, high-yield production is to be realized (see Chapter 5). A good example of ceramic interconnection boards are the multilayer ceramic (MLC) stractures used in large IBM computers (Figure 4.11). These boards measure up to 100 cm in area and contain up to 33 layers. They can interconnect as many as 133 chips. Their fabrication involves hundreds of complex chemical processes that must be precisely controlled. 

In assembling hybrid microcircuits or multichip modules, ceramic interconnect substrates fabricated using thin-film or thick-film processes are attached to the inside base of a ceramic or metal package. Generally, film adhesives that have been cut to size are used to attach large substrates (greater than 1-inch square) while either paste or film adhesives may be used for smaller substrates. Substrates may be alumina, beryllia, aluminum nitride, or silicon. 

Directed Oxidation of a Molten Metal. Directed oxidation of a molten metal or the Lanxide process (45,68,91) involves the reaction of a molten metal with a gaseous oxidant, eg, A1 with O2 in air, to form a porous three-dimensional oxide that grows outward from the metal/ceramic surface. The process proceeds via capillary action as the molten metal wicks into open pore channels in the oxide scale growth. Reinforced ceramic matrix composites can be formed by positioning inert filler materials, eg, fibers, whiskers, and/or particulates, in the path of the oxide scale growth. The resultant composite is comprised of both interconnected metal and ceramic. Typically 5—30 vol % metal remains after processing. The composite product maintains many of the desirable properties of a ceramic however, the presence of the metal serves to increase the fracture toughness of the composite. 

S.3.2 Sol-Gel Encapsulation of Reactive Species Another new and attractive route for tailoring electrode surfaces involves the low-temperature encapsulation of recognition species within sol-gel films (41,42). Such ceramic films are prepared by the hydrolysis of an alkoxide precursor such as, Si(OCH3)4 under acidic or basic condensation, followed by polycondensation of the hydroxylated monomer to form a three-dimensional interconnected porous network. The resulting porous glass-like material can physically retain the desired modifier but permits its interaction with the analyte that diffuses into the matrix. Besides their ability to entrap the modifier, sol-gel processes offer tunability of the physical characteristics... 

Interconnects are formed into the desired shape using ceramic processing techniques. For example, bipolar plates with gas channels can be formed by tape casting a mixture of the ceramic powder with a solvent, such as trichloroethylene (TCE)-ethanol [90], Coating techniques, such as plasma spray [91] or laser ablation [92] can also be used to apply interconnect materials to the other fuel cell components. 

Figure 22. Multichip package for electrooptical-signal-processing applications, with TFML interconnections on a ceramic substrate housed in a metal flatpack. (Reproduced from reference 80. Copyright 1987 American Chemical Society.)...

---