Interconnection Technology Research

The development of a molded interconnect technology has spanned more than a decade of materials and chemistry development and process refinement. What began as a concept in the minds of several entrepreneurial companies and research technologists, has finally achieved true market commercialization. Molded boards and... 

The authors gratefully acknowledge the essential contributions from a great number of our colleagues, too numerous to mention, in the Research and Microelectronics Divisions, who share credit for the successful innovation and implementation of Cu interconnect technology. 

Several new surface micromachining processes utilize the thick-fihn polymer SU-8 for fabrication of channels, wells, and other passive microfluidics that are integrated with electronics or optical detection devices. The development of actuation schemes and interconnect technologies may make integrated polymer microfluidic systems more attractive, although more research is needed for these components as well as the integration of the polymers with other materials to realize truly integrated systems. 

Introduction of microelectronic microwave components close to the antenna demands for appropriate interconnect technologies on textiles. This aspect has been dealt with in various publications, both with woven and non-woven materials However, only little data is available on the microwave properties of different woven and non-woven materials This deficiency must be overcome. Interconnection to the microwave monolithic integrated circuit is an important area of research and development. One possible approach is the implementation of ribbon type interconnects, which can efficiently be used for power supply and low ficquency outyut signals. 

Amend, P. et al. ADDIMID Technology and Aerosol Jet Printing for Functional MID Prototypes by the Use of Stereolithography. In Proceedings 10th International Congress Molded Interconnect Devices, Research Association Molded Interconnect Devices 3-D MID e. V., Fiirth, 19-20 September 2012. 

Nortel Networks began its lead-free research in 1991 as part of an industry consortium with TTRI Ltd., Multicore Solders, and GE-Marconi. The company selected the desktop telephone for its lead-free product redesign because it allowed the company to test the lead-free manufacturing process on an assortment of lead shapes [22]. Prototype phones were constructed on existing manufacturing lines in 1996 and intended to be operationally equivalent to those manufactured with traditional Sn-Pb solder. When introduced in 1997, it was the first desktop telephone produced entirely with a lead-free interconnection technology. A commercially available (Multi-... 

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