High Density Interconnect

In the multichip package, a variety of pretested chips (e.g., bipolar, MOS, and GaAs) and discrete components (decoupling capacitors and termination resistors) may be mounted on the high-density interconnection substrate. This approach is sometimes termed hybrid-wafer-scale integra-... 

Alternative polymers that have certain advantages over polyimides have also been introduced they include poly(phenylquinoxaline), poly(phenylquinoline), and poly(benzocyclobutenes) (PBCBs) (93,116). The PBCBs have a low curing temperature (250 °C), low dielectric constant (2.6), low dissipation factor (0.0045), and low moisture absorption (0.3%) The development of specialty polymers for packaging and high-density interconnections will continue to be an active area of research as polymer manufacturers focus on the needs of the microelectronic industry. 

Cole HS, Gorowitz B, Gorczyca T, Wojnarowski R, Lupinski J (1992) Polymeric materials requirements for the GE high-density interconnect process. Mater Res Soc Symp Proc 264 (Electronic Packaging Materials Science VI) 43... 

TSVs are an important component of all four wafer-level 3D technology platforms discussed above. In the via-lirst approaches, the I/O connections from the bond layer to the top of the stack are accomplished by TSVs, and in the via-last approach, these interconnects as well as the interwafer interconnects are defined by TSVs. In general, to accomplish high-performance high-density interconnection, TSVs should be as short and small as possible. 

Gann K,Neo-stacking technology. High Density Interconnect Magazine Vol. 2, 1999. 

Gupta S, Hilbert M, Hong S, Patti R. Techniques for producing 3D ICs with high-density interconnect. In Proceedings of 2004 VLSI Multilevel Interconnection Conference 2004. p 93-97. 

Francis D. Thinning wafers for flip chip applications. High Density Interconnect Magazine 1999 2(5) 22-25. 

K. K. Chakravorty, C. P. Chien, J. M. Cech, M. H. Thnielian, and P. L. Young, High-Density Interconnection Using Photosensitive Polyimide and Electroplated Copper Conductor Lines, IEEE Comp., Hybrids., Manuf. Technol., 13, No. 1, pp. 200-206 (1990). 

High Density Interconnection Group, Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba Central 2, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568, Japan t.yokoshima aoni.waseda.jp... 

Modulated Reverse Electric Field Copper Metallization for High Density Interconnect and Very Large Scale Integration Applications... 

E J. Taylor, C. Zhou, and J. Sun, Electrodeposition of Metals in Small Recesses for Manufacture of High Density Interconnects Using Modulated Electric Field", filing date, 29 January, 1999... 

On one side the development is based on thin film and micro-patterning technologies. Wafer level and foil processes used to produce high density interconnect electronic modules, and wafer level packaging was adapted to micro fuel cell development to achieve the required miniaturisation and cost reduction. By using reactive ion etching, high aspect ratio capillary structures of the anode and cathode side flow fields were achieved. 

Levinson LM, et al. High density interconnects using laser lithography. Int. Soc. Hybrid Microelectronics. 1998 West. 1989. 

McCabe JD. Selecting the right die-attach adhesive. High Density Interconnect. Jul. 2001 32-6. 

Gilleo K, Colterman B, Chen T. Molded underfill from flip chip in package. High Density Interconnect. Jun. 2000 28-31. 

HDI High Density Interconnect, also Hexamethylene Diisocyanate ... 

Levinson, L. M., et al. High Density Interconnects Using Laser Lithography, Proc. NEPCON West (1989)... 

McCabe, J. D., Selecting the Right Die-Attach Adhesive, High Density Interconnect, pp. 32-36 (Jul. 2001)... 

Gilleo, K., Colterman, B., and Chen, T., Molded Underfill fi-om Flip Chip in Package, High Density Interconnect, pp. 28-31 (Jun. 2000)... 

Ablefill UF 8807/ Ablestik Labs. Moisture-resistant cyanate ester (silica filled) 10 Plastic, ceramic, andPWB laminates Dispense, capillary underfill CSP or BGA packages and high-density interconnect substrates... 

Lower-thermal-expansion printed circuit boards for fine-featured solder joints in high-density interconnection circuitry... 

The major advantages of this technology include the ability to provide high-density interconnections with relatively short path lengths, which lead to higher-speed computers excellent thermal dissipation the ability to operate at elevated temperatures, excellent structural strength provision for a hermetically sealed transistor enclosure, excellent dimensional stability, and an overall low thermal coefficient of expansion. 

T. Dixon, Multilayer Ceramics The Key to High Density Interconnections pp. 76-82, Electronic Packaging and Production, February 1983. ... 

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