Electronics packaging and interconnection

C. A. Harper, Electronic Packaging and Interconnection Handbook, McGraw-HiU Book Co., Inc., New York, 1991. 

Jawitz, M. 1997. Printed Circuit Board Materials Handbook. In Electronic Packaging and Interconnection Series. McGraw-Hill, New York. 

Lupinski JH, Moore RS (eds) (1989) Polymeric materials for electronic packaging and interconnection. ACS Symposium Series 407... 

If the two different polyamic acid solutions were mixed and then cured, the glass transition temperatures of the cured polyimides are different from those corresponding to separately cured polyimides. These results are interpreted as transamidization which gives random co-polymer(s). C. Feger in Polymeric Materials for Electronic Packaging and Interconnections J.H. Lupinski and R.S. Moore Eds American Chemical Society Washington, DC, 1989 p 114. 

Polymeric materials for electronics packaging and interconnection. John H. Lupin ski, editor Robert S. Moore, editor. 

From a number of standpoints, progress in electronics is becoming critically dependent on electronic packaging and interconnection. The ability to achieve fast clock rates, sufficient heat... 

Polymers are playing increasingly important roles in packaging and interconnection as the versatility of being able to customize their mechanical and electrical properties becomes better established and more well known. The rest of this book presents specific chapters on polymeric materials and their applications in this field. In reading them it is hoped the reader will keep in mind the increasingly important roles of these materials, their consequent market value, and their place in the hierarchy of electronic packaging and interconnection. 

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