Interconnect materials, for

Zhu WZ and Deevi SC. Development of interconnect materials for solid oxide fuel cells. Mater. Sci. Eng. A 2002 A348 227-243. 

Liu Z, Dong D, Huang Z, Lti Z, Sui Y, Wang X, Miao J, Shen ZX, and Su W. A novel interconnect material for SOFCs. Electrochem. Solid-State Lett. 2005 8 A250-A252. 

Stability for use in optical interconnects. In the near future, optoelectronic integrated circuits and optoelectronic multichip modules will be produced. Materials with high thermal stability will thus become very important in providing compatibility with conventional 1C fabrication processes and in ensuring device reliability. Polyimides have excellent thermal stability so they are often used as electronic materials. Furuya et al. introduced polyimide as an optical interconnect material for the first time. Reuter et al. have applied polyimides to optical interconnects and have evaluated the fluorinated polyimides prepared from 6FDA and three diamines, ODA (3), 2,2-bis(3-aminophenyl) hexafluoropropane (3,3 -6F) (4), and 4,4 -6F (2), as optical waveguide materials. 

As device features diminish in size, Cu CMP has become the dominant CMP process for processing this device in the back end. Cu has several attributes that make it attractive as an interconnect material for such devices.f Electrochemically, Cu is noble compared to W and Al. Its hardness falls between W and A1 and will not scratch as easily as Al. It has higher electromigration resistance than W or Al/Cu, which has been conventionally used as the interconnect metal in current devices. 

MICROSTRUCTURAL CHARACTERIZATION OF La-Cr-O THIN FILM DEPOSITED BY RF MAGNETRON SPUTTERING ON THE STAINLESS STEEL INTERCONNECT MATERIALS FOR SOFC APPLICATION... 

L., and Quadakkers, W.J. (2010) Potential suitability of ferritic and austenitic steels as interconnect materials for solid oxide fuel cells operating at... 

Keusseyan, R.L., Amey, D.I., and Horowitz, S.J., New low cost interconnection materials for high frequency MCM applications, IMAPS Multichip Module Conference, Denver, CO, 1998. 

Broadly, interconnect materials for SOFC fall into two categories conductive ceramic (perovskite) materials for operation at high temperature (900 to 1000 °C) and metallic alloys for lower temperature operation. Though the shape of SOFC interconnects depends heavily on the cell and stack design, the materials choice is almost entirely determined by physical and chemical stability under operating conditions. 

A proven interconnect material for operating in the intermediate temperature range (650 to 800 °C) does not yet exist. 

Huczkowski, P., et al. Growth Rate and Electrical Conductivity of Oxide Scales on Ferritic Steels Proposed as Interconnect Materials for SOFC. in Sixth European Solid Oxide Fuel Cell Forum. 2004. Luzern, der Schweiz European Fuel Cell Forum. 

Equation 7.30 shows that charge conductivity depends directly on the charge mobility velocity (i/j) and the charge concentration (Q in the base materials such as the electrode and interconnect material for electrons transport and the electrolyte materials for ion transport. 

Lanthanum chromite-based perovskite oxides (LaCrOs) have been widely recognized as promising interconnect materials for solid oxide fuel cells (SOFCs). The interconnects must separate fuel and oxidant gases and also have high electronic conductivity at high temperature (773-1273 K). Therefore, interconnects should meet the following requirements ... 

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