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Polymeric materials for electronics packaging and interconnection

Lupinski JH, Moore RS (eds) (1989) Polymeric materials for electronic packaging and interconnection. ACS Symposium Series 407... [Pg.109]

If the two different polyamic acid solutions were mixed and then cured, the glass transition temperatures of the cured polyimides are different from those corresponding to separately cured polyimides. These results are interpreted as transamidization which gives random co-polymer(s). C. Feger in Polymeric Materials for Electronic Packaging and Interconnections J.H. Lupinski and R.S. Moore Eds American Chemical Society Washington, DC, 1989 p 114. [Pg.195]

Polymeric materials for electronics packaging and interconnection. John H. Lupin ski, editor Robert S. Moore, editor. [Pg.2]

Lusignea, R., J. Piche, and R. Mathisen, in Polymeric Materials for Electronic Packaging and Interconnection, ACS Symposium Series 407,446-455, 1989. [Pg.61]

See other pages where Polymeric materials for electronics packaging and interconnection is mentioned: [Pg.164]    [Pg.273]    [Pg.273]    [Pg.1]    [Pg.5]    [Pg.6]    [Pg.273]    [Pg.273]    [Pg.164]    [Pg.273]    [Pg.273]    [Pg.1]    [Pg.5]    [Pg.6]    [Pg.273]    [Pg.273]    [Pg.17]    [Pg.1023]    [Pg.3]    [Pg.96]    [Pg.261]    [Pg.236]   


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Electron material

Electronic materials

Electronic packaging

Electronics materials

Electronics packaging

Interconnect

Interconnect Materials

Interconnected

Interconnection and packaging

Interconnection materials

Interconnections

Interconnects

Materials polymerization

Package material

Packaging and Materials

Packaging for

Packaging materials

Polymeric materials

Polymeric materials for electronics packaging

Polymerized materials

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