Multi process interconnection

The word truth is a multi-meaning word which can be applied both to science and life. We will not raise social problems but we will go down to the science, particularly chemical science (organic and physical chemistry). We choose chemical kinetics as a method of research because chemical kinetics is a science about chemical processes, mechanisms of reactions, and about possibilities of directing reactions. Parts of the articles in this volume deal with chemical physics, biochemical physics, and physical organic chemistry. All of these fields of science are interconnected with each other. 

The above concept of forming adhesive bonds in the solid state has been used to demonstrate the possibility of the parallel processing of a multi-chip module substrate, consisting of a multilayered polymer substrate with circuitry embedded on each polymer layer via lithographic processing [43], In this case, it is essential that the polymeric layer retains its dimensional stability so that registration and interconnections between the layers can be achieved using a Pb-Sn solder (see Fig. 28). A copolyester which appears to be ideally suited for this purpose is the 4/1 PHBA/BPT which melts at 320 °C in the randomized form... 

Computers, microprocessors, and other microelectronic devices could not exist as we know them today without the technology of depositing thin metal or alloy films with fine lithographic patterns. For example, in a computer, the individual transistors that make up an integrated circuit must be electrically interconnected by a complex network of conducting lines and vias that are deposited above the semiconductor layers. Furthermore, the chips are joined to multi-chip packaging modules, a process in which many electrical connections are simultaneously established by solder balls. 

An example of a multi-functional electro-mechanical interconnect device produced using the two-shot process is shown in Figure 8. 

The most common topology of ANN is a feed-forward multi-layer network where neurons are arranged in layers, from input to output with interconnecting weights between two adjacent layers. Each neuron within the network processes one or more inputs coming into it and produces an output (decided by activation function) for the next layer. At each... 

New structures or advancements on existing structures are then needed to make these interconnections. These structures—such as blind and buried vias, multi-lamination (sub-laminations), and build-up technologies—directly impact multilayer processing. Deeper bhnd vias and buried vias have caused a major increase in the demand for reliable via filling materials and methods. Relatively new materials, equipment, and processes have and are being developed to address this need. A new section in this chapter, Filled Via Processing and Sequential Lamination, addresses filled vias internal to the PCB. 

Chemical Mechanical Planarization (CMP) process is used to prepare silicon wafer surfaces for multi-layer integrated circuits containing copper interconnections [42]. 

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