Interconnect device

Automated soldering operations can subject the mol ding to considerable heating, and adequate heat deflection characteristics ate an important property of the plastics that ate used. Flame retardants (qv) also ate often incorporated as additives. When service is to be in a humid environment, it is important that plastics having low moisture absorbance be used. Mol ding precision and dimensional stabiUty, which requites low linear coefficients of thermal expansion and high modulus values, ate key parameters in high density fine-pitch interconnect devices. 

Main bus, its feeding tap-offs and interconnecting links or cables etc. and all outgoing links, interconnecting devices that are also connected on the main bus such as shown at section F. Figure 13.29. 

FIGURE 4.11 Cross-section of the IBM Multilayer Ceramic interconnection package. Various layers in this interconnection device are shown. Copyright 1982 by International Business Machines Corporation. Reprinted with permission. 

American Seal, USA K M Seals, USA [101 Interconnect Devices, USA PTR Mess-... 

Surface-mount devices, surface-mount interconnection devices, PCMCIA card frames... High-performance motor components... 

Fluidic and Electrical Interconnects - Device-to-device and Device-to-world 523... 

Stuart cell — Monopolar water - electrolysis tank cell employing plate electrodes with those of the same polarity connected in parallel resulting in a cell voltage of 1.7-2 V. Cells are connected in series, the inherent drawbacks of cells of the filterpress design (e.g., complicated sealing and interconnect devices) are avoided. 

An example of a multi-functional electro-mechanical interconnect device produced using the two-shot process is shown in Figure 8. 

In the case of device applications, the filling material is some form of dielectric material, such as oxides, polymers, or polycrystalline silicon. (Metal filled trenches could serve as buried interconnecting device lines). As suggested previously, generally two types of trenches may have to be filled up - narrow ones for device isolation, and wider ones to benefit other circuit functions. The process requirements are somewhat different for each. However, independent of the trench width, the initial processing is the same. 

The use of thermoplastics and their selective metal plating opens a new dimension in circuit carrier design to the electronics industry 3D molded interconnect devices (3D MIDs). MIDs are injection-molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer remarkably improved ecological behavior in comparison to conventional printed circuit boards which they wiU, however, complement, not replace. 

Of the mass-transfer dispensing methods, screen printing and stencil printing are the oldest and most widely used. Screen printing has been used for over 40 years in the electronics industry to apply thick-film conductors, resistors, and dielectrics in fabricating circuits on ceramic and plastic-laminate substrates. Screen printing is also used as a batch process for depositing electrically conductive and insulative adhesives to interconnect devices on thin-film and thick-film hybrid microcircuits. 

Recently, MID (Molded Interconnection Device) technology was introduced by utilizing LCPs characteristics to its fullest. MID is a concept which can eliminate metal lead frame and metal contact pin on electronic devices by plastic metalization. This new technology contributes to miniaturization and reliability increase for various electronic devices. 

Printed circuit board (PCB) A board of electrically insulating material on which has been deposited (printed) conductors that electrically interconnect devices mounted on the board. Almost all electronic systems that consist of more than a few devices utilize one or more PCBs for packaging the electronic system. Quantum well The region of a laser diode where the density of electrons is very high, resulting in increased lasing efficiency and reduced heat generation. 

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