Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Computers, interconnects

In addition, most devices provide operator control of settings for temperature and/or response slope, isopotential point, zero or standardization, and function (pH, mV, or monovalent—bivalent cation—anion). Microprocessors are incorporated in advanced-design meters to faciHtate caHbration, calculation of measurement parameters, and automatic temperature compensation. Furthermore, pH meters are provided with output connectors for continuous readout via a strip-chart recorder and often with binary-coded decimal output for computer interconnections or connection to a printer. Although the accuracy of the measurement is not increased by the use of a recorder, the readabiHty of the displayed pH (on analogue models) can be expanded, and recording provides a permanent record and also information on response and equiHbrium times during measurement (5). [Pg.467]

The applications we discuss here, in magnets, power transmission, computer interconnections, Josephson devices and instrumentation, have almost all been studied before, during two decades of active work in applied superconductivity 41. Thought of simply as a standard superconductor with a higher transition temperature, YBaCuO does not by itself imply new kinds of applications, even though it may improve the commercial prospects for applications previously burdened by overhead costs associated with helium refrigeration. More novel applications may well emerge in the future. [Pg.281]

The complexity analysis shows that the load is evenly balanced among processors and therefore we should expect speedup close to P and efficiency close to 100%. There are however few extra terms in the expression of the time complexity (first order terms in TV), that exist because of the need to compute the next available row in the force matrix. These row allocations can be computed ahead of time and this overhead can be minimized. This is done in the next algorithm. Note that, the communication complexity is the worst case for all interconnection topologies, since simple broadcast and gather on distributed memory parallel systems are assumed. [Pg.488]

Other techniques that work well on small computers are based on the molecules topology or indices from graph theory. These fields of mathematics classify and quantify systems of interconnected points, which correspond well to atoms and bonds between them. Indices can be defined to quantify whether the system is linear or has many cyclic groups or cross links. Properties can be empirically fitted to these indices. Topological and group theory indices are also combined with group additivity techniques or used as QSPR descriptors. [Pg.308]

By electronic engineering, a system of interconnected switching devices is able to respond in one of only two modes (on or off), and these modes can be controlled at the basic level of a bit. Bits are assembled into bytes, as with an 8-bit device, and through programming of the bytes a computer central processor can be made to follow sets of instructions (programs) written in special languages, either at a direct level (machine code) that can be acted upon immediately by a computer or at a high level that is translated for the user into machine code. [Pg.310]

Electrical Applications. The largest application of PTFE is for hookup and hookup-type wire used in electronic equipment in the military and aerospace industries. Coaxial cables, the second largest appHcation, use tapes made from fine powder resins and some from granular resin. Interconnecting wire appHcations include airframes. Other electrical appHcations include computer wire, electrical tape, electrical components, and spaghetti tubing. [Pg.355]

Ca.pa.cita.nce, This property is dependent on the dimensions of the inner and outer conductors and the dielectric constant of the core. Most computer systems have a maximum allowable capacitance for interconnecting cables. For these systems, the lower the capacitance of the core material, the longer the cable that can be used. [Pg.326]

Transputers. At higher levels of coimectedness there is a wide variety of parallel computers. A great many parallel computers have been built using INMOS Transputer chips. Individual Transputer chips mn at 2 MELOPS or greater. Transputer chips have four communication channels, so the chips can readily be intercoimected into a two-dimensional mesh network or into any other interconnection scheme where individual nodes are four-coimected. Most Transputer systems have been built as additions to existing host computers and are SIMD type. Each Transputer has a relatively small local memory as well as access to the host s memory through the interconnection network. Not surprisingly, problems that best utilize local memory tend to achieve better performance than those that make more frequent accesses to host memory. Systems that access fast local memory and slower shared memory are often referred to as NUMA, nonuniform memory access, architecture. [Pg.96]

A fault tree is a graphical form of a Boolean equation, but the probability of the top event (and lesser events) can be found by substituting failure rates and probabilities for these iwo-staie events. The graphical fault tree is prepared for computer or manual evaluation by pruning" it of less significant events to focus on more significant events. Even pruned, the tree may be so large that it IS intractable and needs division into subtrees for separate evaluations. If this is done, care must be taken to insure that no information is lost such as interconnections between subtrees. [Pg.111]

Such units are used in the watches with electronic drives instead of the traditional mechanical spring driven drives. Another area where the combination function is being used is in large-scale integrated circuit unit supports where the complex interconnection requirements make a combination circuit support and printed circuit unit an attractive way to achieve high packing efficiency such as computer hardware systems. [Pg.226]

Ceramic boards are currently widely used in high-performance electronic modules as interconnection substrates. They are processed from conventional ceramic precursors and refractory metal precursors and are subsequently fired to the final shape. This is largely an art a much better fundamental understanding of the materials and chemical processes will be required if low-cost, high-yield production is to be realized (see Chapter 5). A good example of ceramic interconnection boards are the multilayer ceramic (MLC) stractures used in large IBM computers (Figure 4.11). These boards measure up to 100 cm in area and contain up to 33 layers. They can interconnect as many as 133 chips. Their fabrication involves hundreds of complex chemical processes that must be precisely controlled. [Pg.61]

At every clock tick, the developmental program of each cell (in the graph of interconnected cells) computes its next state and whether it will produce a new cell or not. Division produces a new cell with exactly the same (unchangeable) developmental program as the mother cell, but with a new location = location of the mother cell + 1. Because CGP and by extension DCGP only allow feed-forward graphs, the inputs of all cells will come from external inputs and/or the outputs of other cells, which are directly/indi-rectly connected to the external inputs. Hence, if the external inputs stay stable, then so will the outputs of all the cells in the graph. [Pg.310]


See other pages where Computers, interconnects is mentioned: [Pg.280]    [Pg.82]    [Pg.280]    [Pg.82]    [Pg.362]    [Pg.345]    [Pg.354]    [Pg.96]    [Pg.97]    [Pg.539]    [Pg.509]    [Pg.773]    [Pg.165]    [Pg.262]    [Pg.372]    [Pg.312]    [Pg.435]    [Pg.609]    [Pg.65]    [Pg.149]    [Pg.137]    [Pg.763]    [Pg.1322]    [Pg.650]    [Pg.330]    [Pg.776]    [Pg.55]    [Pg.231]    [Pg.37]    [Pg.99]    [Pg.52]    [Pg.491]    [Pg.1004]    [Pg.219]    [Pg.220]    [Pg.108]    [Pg.53]    [Pg.85]    [Pg.93]    [Pg.81]   
See also in sourсe #XX -- [ Pg.294 ]




SEARCH



Interconnect

Interconnected

Interconnections

Interconnects

© 2024 chempedia.info