Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Copper interconnects for ceramic substrates and packages

Figure 23. Multichip package for a supercomputer. Top, unpopulated substrate with TFML copper-polyimide interconnections on a 100 by 100 mm multilayer ceramic substrate bottom, cross section of interconnection structure and flip-TAB carrier. (Reproduced with permission from reference 81. Copyright 1985 Institute of Electrical and Electronics Engineers.)... Figure 23. Multichip package for a supercomputer. Top, unpopulated substrate with TFML copper-polyimide interconnections on a 100 by 100 mm multilayer ceramic substrate bottom, cross section of interconnection structure and flip-TAB carrier. (Reproduced with permission from reference 81. Copyright 1985 Institute of Electrical and Electronics Engineers.)...
See other pages where Copper interconnects for ceramic substrates and packages is mentioned: [Pg.327]    [Pg.329]    [Pg.331]    [Pg.333]    [Pg.335]    [Pg.337]    [Pg.339]    [Pg.341]    [Pg.343]    [Pg.345]    [Pg.347]    [Pg.349]    [Pg.351]    [Pg.353]    [Pg.355]    [Pg.357]    [Pg.359]    [Pg.327]    [Pg.329]    [Pg.331]    [Pg.333]    [Pg.335]    [Pg.337]    [Pg.339]    [Pg.341]    [Pg.343]    [Pg.345]    [Pg.347]    [Pg.349]    [Pg.351]    [Pg.353]    [Pg.355]    [Pg.357]    [Pg.359]    [Pg.480]    [Pg.235]    [Pg.480]    [Pg.228]    [Pg.74]   


SEARCH



Ceramic interconnects

Ceramic package

Ceramic substrate

Copper interconnect

Copper interconnects

Interconnect

Interconnect substrates

Interconnected

Interconnection and packaging

Interconnections

Interconnects

Packaging for

Substrate copper

© 2024 chempedia.info