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292 / Lead-Free Solder Interconnect

Shangguan, Dongkai, Lead-Free Solder Interconnect Reliability, ASM International, July 2006, pp. 185-198. [Pg.1432]

Lead-Free Solder Interconnect Reliability 05101G... [Pg.1]

Failure analysis is useful for providing the failure locations, modes and mechanisms, verifying the reliability test data and reliability prediction, and providing insights into the physical, chemical, electrical, mechaiucal, and thermal behaviors of solder joints (Ref 104-105). The failure modes of lead-free solder interconnects are similar to those for the tin-lead solder (Ref 104), under various loading conditions. Techniques for failure analysis for lead-free solder joints will be presented in Chapter 10. [Pg.18]

Lead-Free Solder Interconnect Reliability Dongkai Shangguan, editor, p29-65 D01 10.1361/lsir2005p029... [Pg.29]

Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects... [Pg.29]

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Accelerated Testing Methodology for Lead-Free Solder Interconnects

Evolution and Interfacial Interactions in Lead-Free Solder Interconnects

Interconnect

Interconnected

Interconnections

Interconnects

LEAD-FREE

Lead-Free Solder Interconnect Reliability

Lead-free solder interconnects

Lead-free solder interconnects interfacial interactions

Lead-free solder interconnects thermomechanical reliability prediction

Lead-free soldering

Lead-free solders

Lead-soldering

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