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Photoresist

A unique but widely studied polymeric LB system are the polyglutamates or hairy rod polymers. These polymers have a hydrophilic rod of helical polyglutamate with hydrophobic alkyl side chains. Their rigidity and amphiphilic-ity imparts order (lyotropic and thermotropic) in LB films and they take on a F-type stmcture such as that illustrated in Fig. XV-16 [182]. These LB films are useful for waveguides, photoresists, and chemical sensors. LB films of these polymers are very thermally stable, as was indicated by the lack of interdiffusion up to 414 K shown by neutron reflectivity of alternating hydrogenated and deuterated layers [183]. AFM measurements have shown that these films take on different stmctures if directly deposited onto silicon or onto LB films of cadmium arachidate [184]. [Pg.561]

Novolak photoresist Novolak process Novolak resin... [Pg.689]

L First manufacturing use of chemically amplified resists Plasma-developed resist first described X-ray proximity lithography demonstrated Bis-azide rubber resists introduced DNO-novolac resist for microelectronics introduced Photoresist technology first applied to transistor fabrication DNO-novolac resist patented by Kalle... [Pg.114]

Dichromated Resists. The first compositions widely used as photoresists combine a photosensitive dichromate salt (usually ammonium dichromate) with a water-soluble polymer of biologic origin such as gelatin, egg albumin (proteins), or gum arabic (a starch). Later, synthetic polymers such as poly(vinyl alcohol) also were used (11,12). Irradiation with uv light (X in the range of 360—380 nm using, for example, a carbon arc lamp) leads to photoinitiated oxidation of the polymer and reduction of dichromate to Ct(III). The photoinduced chemistry renders exposed areas insoluble in aqueous developing solutions. The photochemical mechanism of dichromate sensitization of PVA (summarized in Fig. 3) has been studied in detail (13). [Pg.115]

Fig. 7. Chemistiy of a diy-filin, negative-acting photoresist, (a) Polymerizable layer sandwiched between a polyolefin carrier sheet and a polyester cover... Fig. 7. Chemistiy of a diy-filin, negative-acting photoresist, (a) Polymerizable layer sandwiched between a polyolefin carrier sheet and a polyester cover...
Fig. 8. Protection of a plated through-hole in a PWB during etching by using a tenting dry-film photoresist. Fig. 8. Protection of a plated through-hole in a PWB during etching by using a tenting dry-film photoresist.
Today the market for photoresists used in the manufacture of integrated circuits is estimated to be 750 million U.S. aimually, with... [Pg.118]

Positive-Tone Photoresists based on Dissolution Inhibition by Diazonaphthoquinones. The intrinsic limitations of bis-azide—cycHzed mbber resist systems led the semiconductor industry to shift to a class of imaging materials based on diazonaphthoquinone (DNQ) photosensitizers. Both the chemistry and the imaging mechanism of these resists (Fig. 10) differ in fundamental ways from those described thus far (23). The DNQ acts as a dissolution inhibitor for the matrix resin, a low molecular weight condensation product of formaldehyde and cresol isomers known as novolac (24). The phenoHc stmcture renders the novolac polymer weakly acidic, and readily soluble in aqueous alkaline solutions. In admixture with an appropriate DNQ the polymer s dissolution rate is sharply decreased. Photolysis causes the DNQ to undergo a multistep reaction sequence, ultimately forming a base-soluble carboxyHc acid which does not inhibit film dissolution. Immersion of a pattemwise-exposed film of the resist in an aqueous solution of hydroxide ion leads to rapid dissolution of the exposed areas and only very slow dissolution of unexposed regions. In contrast with crosslinking resists, the film solubiHty is controUed by chemical and polarity differences rather than molecular size. [Pg.118]

I ovolac Synthesis and Properties. Novolac resins used in DNQ-based photoresists are the most complex, the best-studied, the most highly engineered, and the most widely used polymers in microlithography. Novolacs are condensation products of phenoHc monomers (typically cresols or other alkylated phenols) and formaldehyde, formed under acid catalysis. Figure 13 shows the polymerization chemistry and polymer stmcture formed in the step growth polymerization (31) of novolac resins. [Pg.120]

Pos twe-Tone Photoresists. The ester, carbonate, and ketal acidolysis reactions which form the basis of most positive tone CA resists are thought to proceed under specific acid catalysis (62). In this mechanism, illustrated in Figure 22 for the hydrolysis of tert-huty acetate (type A l) (63), the first step involves a rapid equihbrium where the proton is transferred between the photogenerated acid and the acid-labile protecting group ... [Pg.126]

W. DeForest, Photoresist Materials andProcesses, McGraw-HiU, New York, 1975. [Pg.136]

Photoresist appHcations in the microelectronics industry have also been disclosed (340). Thermally stable ben2yl sulfonate esters based on 2-methyl-3-nitroben2otrifluoride [6656-49-1] can serve as nonionic photoacid generators to promote a cascade of reactions during irradiation of the resist. [Pg.333]

Miscellaneous Applications. PEIs and their derivatives ate used as cementation auxihaties in cmde oil exploration (459), and for breaking cmde oil emulsions (460) in cmde oil extraction. Seed coatings of water-soluble copolymers containing polyethyleneimine have been developed (461). Polyethyleneimine derivatives have positive photoresist properties (462) amidated polyethyleneimines improve the flow properties of cement (463) and with few exceptions, A/-acyla2iddines act as chemical sterilisers for insects (464). [Pg.14]

Fig. 6. Schematic illustration of the photohthographic patterning process used for defining features in siUcon dioxide using ( ) a positive photoresist that polymerizes light, where ( ) represents the mask (U) Si02 and ( ) Si. Development includes removal of the mask and undeveloped photoresist. Fig. 6. Schematic illustration of the photohthographic patterning process used for defining features in siUcon dioxide using ( ) a positive photoresist that polymerizes light, where ( ) represents the mask (U) Si02 and ( ) Si. Development includes removal of the mask and undeveloped photoresist.
Traditional appHcations for latices are adhesives, binders for fibers and particulate matter, protective and decorative coatings (qv), dipped goods, foam, paper coatings, backings for carpet and upholstery, modifiers for bitumens and concrete, and thread and textile modifiers. More recent appHcations include biomedical appHcations as protein immobilizers, visual detectors in immunoassays (qv), as release agents, in electronic appHcations as photoresists for circuit boards, in batteries (qv), conductive paint, copy machines, and as key components in molecular electronic devices. [Pg.23]

Soft x-rays with wavelengths of 1—10 nm ate used for scanning x-ray microscopy. A zone plate is used to focus the x-ray beam to a diameter of a few tens of nanometers. This parameter fixes and limits the resolution. Holographic x-ray microscopy also utilizes soft x-rays with photoresist as detector. With a strong source of x-rays, eg, synchrotron, resolution is in the 5—20-nm range. Shadow projection x-ray microscopy is a commercially estabflshed method. The sample, a thin film or thin section, is placed very close to a point source of x-rays. The "shadow" is projected onto a detector, usually photographic film. The spot size is usually about 1 ]lni in diameter, hence the resolution cannot be better than that. [Pg.332]

Because the heat distortion temperature of cured epoxy resins (qv) increases with the functionality of the curing agents, pyromellitic dianhydride is used to cross-link epoxy resins for elevated temperature service. The dianhydride may be added as a dispersion of micropulverized powder in liquid epoxy resin or as a glycol adduct (158). Such epoxies may be used as an insulating layer in printed circuit boards to improve heat resistance (159). Other uses include inhibition of corrosion (160,161), hot melt traffic paints (162), azo pigments (163), adhesives (164), and photoresist compounds (165). [Pg.500]


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AZ Photoresist

Acid-catalyzed photoresist films

Applications of Photoresist Microelectrodes

Applications, molecular electronics photoresists

Casting photoresist

Chemical amplification photoresists

Chemically amplified photoresist

Commercial photoresists

Contrast photoresist

Conventional photoresists limitations

Conventional positive photoresist

DNS-novolac positive photoresist

Deep-UV photoresists

Development, positive photoresist

Development, positive photoresist lithographic

Development, positive photoresist performance

Diazoquinone positive photoresists

Dry film photoresist

Electrochemical deposition photoresists

Electrodes photoresist micro

Electronics industry photoresists

Environmentally stable chemical amplification positive photoresist

Epoxy-based photoresist

Fabrication techniques photoresist pattern

Gate photoresist

Imaging Liquid photoresists

Influence photoresist thickness

Layer photoresist

Light intensity photoresists

Liquid Photoresists

Lithography positive photoresist

Microelectrodes, photoresist

Microlenses Formed by Thermally Reflowing Photoresists

Mid-and Deep-UV Photoresists

Naphthalene diazoquinones, photoresist

Negative photoresist

Negative photoresist commercially available

Negative photoresists

Negative tone photoresists

Negative-tone photoresist

Novolac based positive photoresists

Novolac resin composite photoresists

Novolac-based photoresists

Novolak photoresists

Of polyacrylate-based photoresists

PHOTORESISTS Resists

Photoactive compounds for positive-working ED photoresists

Photolithography photoresists

Photopolymers and Photoresists for Electronics

Photoresist Applications for Printing

Photoresist Composition

Photoresist Microelectrochemistry (Nanoliter Droplet Method)

Photoresist Reflow

Photoresist applications

Photoresist cationic

Photoresist conductive coating

Photoresist development rate

Photoresist diazoquinone positive

Photoresist dissolution, importance

Photoresist dynamics

Photoresist film, relief images

Photoresist insulator

Photoresist latent acids

Photoresist lines

Photoresist lithographic performance

Photoresist material

Photoresist modifications

Photoresist novolac-based positive

Photoresist patterning

Photoresist patterns, collapse

Photoresist photoresists

Photoresist photoresists

Photoresist poly

Photoresist polymers

Photoresist polymers electron beam

Photoresist polymers negative resist system

Photoresist polymers photodimerization

Photoresist polymers photosensitization

Photoresist polymers plasma-developable

Photoresist polymers plates printing

Photoresist polymers positive resist system

Photoresist polymers types

Photoresist preparation

Photoresist semiconductor manufacturing

Photoresist stripping

Photoresist stripping methods

Photoresist systems

Photoresist technique

Photoresist technology

Photoresist technology polysilanes

Photoresist thickness

Photoresist vinyl polymers

Photoresist wafer fabrication

Photoresist, deposition

Photoresist, film formation

Photoresist, film formation spin-coated

Photoresist, inorganic

Photoresist, pits

Photoresist, thermal property

Photoresist, types

Photoresist, types negative resist

Photoresist, types positive resist

Photoresist, uses

Photoresistance

Photoresistance

Photoresists

Photoresists

Photoresists An Application of Polymers to Microelectronics

Photoresists Containing Sulfonamide Component

Photoresists Handbook of Solvent

Photoresists Latent acids

Photoresists Positive resists

Photoresists acrylic

Photoresists adhesion

Photoresists applications

Photoresists characteristics

Photoresists chemically amplified

Photoresists compositions activated

Photoresists conventional

Photoresists copolymers

Photoresists electrodeposition

Photoresists epoxy

Photoresists laser light

Photoresists lithography, properties

Photoresists modeling

Photoresists novolac

Photoresists photo generated acid

Photoresists properties

Photoresists resins

Photoresists specific types

Photoresists substituents

Photoresists thin film fabrication

Photoresists thin layer imaging

Photoresists, nitrenes

Photoresists-Acid detection

Photosensitization photoresists

Plasma-Developable Photoresists

Poly -based photoresists

Polyacrylate-based photoresist lamination

Polyester photoresists, polymerization

Polyferrocenylsilanes as UV Photoresists

Polyimide-based photoresists

Polymeric materials/polymers photoresists

Polymerization photoresists

Polymers in Photoresist Applications

Polymers photoresist applications

Positive photoresist

Positive photoresist lithographic performance

Positive photoresist photosensitization

Positive photoresist, reactions

Positive photoresists

Positive photoresists commercially available

Positive photoresists dissolution-inhibitor systems

Positive photoresists image reversal

Positive photoresists, composition

Positive photoresists, effects

Positive tone photoresists

Positive-tone photoresist

Positive-type photoresist systems

Process filters photoresists

Properties positive photoresists

Pyrolyzed photoresist films

Pyrolyzed photoresist films (PPF)

Relief images formation, photoresists

Resist materials photoresists

Resist polymer photoresist

SU-8 photoresist

Sensitivity positive photoresists

Silicon-based positive photoresist

Silicon-containing positive photoresists

Stripper photoresist

Wafer process positive photoresist

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