Photoresist, film formation spin-coated

Figure 9. Formation of micropillars from a solid precursor (schematic). (1) A175 nm thick thermal silicon dioxide film is grown on a silicon wafer. (2) A photoresist is applied by spin coating. (3) The oxide film Is selectively exposed, and then (4) selectively plasma etched with CHFs. (5) The photoresist is stripped, and (6) the silicon water is plasma etched with CI2/BCI3. (7) The residual oxide film is removed with a HF etch, and the silicon miaopillars as-formed are ready for use. Courtesy of Dr. A. Perez, Cornell University, Ithaca, NY.

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