Electronic apphcations

DNQ—novolac resist chemistry has proved to have remarkable dexibiUty and extendibiUty. First introduced for printing appHcations, DNQ—novolac resists have been available since the eady 1960s in formulations intended for electronics appHcations. At present, most semiconductor manufacturing processes employ this resist chemistry. Careful contemporary research and engineering support the continuing refinement of this family of materials. 

Grades of acetal resins specifically designed to enhance the excellent lubricity of the material, without sacrifice in other properties, are known. These include Delrin AF, Ultraform N2311, and Celcon LW materials. Antistatic grades, particularly useful in electronic appHcations, have been developed. At least one recendy introduced new grade, Celcon SR90, claims good scuff resistance. 

Because of the development of electronic appHcations for WF, higher purities of WF have been required, and considerable work has been done to improve the existing manufacturing and purification processes (20). Most metal contaminants and gaseous impurities are removed from WF by... 

The Friedel-Crafts ketone synthesis is of commercial importance in upgrading duoroben2ene for dmg, polymer, and electronic appHcations (Table... 

Decafluorobiphenyl [434-90-2] C F C F (mol wt, 334.1 mp, 68°C bp, 206°C), can be prepared by I Jllmann coupling of bromo- [344-04-7] chloro- [344-07-0] or iodopentafluorobenzene [827-15-6] with copper. This product shows good thermal stabiHty decafluorobiphenyl was recovered unchanged after 1 h below 575°C (270). Decafluorobiphenyl-based derivatives exhibit greater oxidative stabiHty than similar hydrocarbon compounds (271). Therm ally stable poly(fluorinated aryl ether) oligomers prepared from decafluorobiphenyl and bisphenols show low dielectric constant and moisture absorption which are attractive for electronic appHcations (272). 

Germanium single crystals intended for electronic apphcations are usuaHy specified according to conductivity type, dopant, resistivity, orientation, and maximum dislocation density. They may be specified to be lineage-free unless the specified resistivity is below about 0.05 H-cm. Minority carrier lifetime and majority carrier mobHity are occasionaHy specified. 

Polyimides (PI) were among the eadiest candidates in the field of thermally stable polymers. In addition to high temperature property retention, these materials also exhibit chemical resistance and relative ease of synthesis and use. This has led to numerous innovations in the chemistry of synthesis and cure mechanisms, stmcture variations, and ultimately products and appHcations. Polyimides (qv) are available as films, fibers, enamels or varnishes, adhesives, matrix resins for composites, and mol ding powders. They are used in numerous commercial and military aircraft as stmctural composites, eg, over a ton of polyimide film is presently used on the NASA shuttle orbiter. Work continues on these materials, including the more recent electronic apphcations. 

Traditional appHcations for latices are adhesives, binders for fibers and particulate matter, protective and decorative coatings (qv), dipped goods, foam, paper coatings, backings for carpet and upholstery, modifiers for bitumens and concrete, and thread and textile modifiers. More recent appHcations include biomedical appHcations as protein immobilizers, visual detectors in immunoassays (qv), as release agents, in electronic appHcations as photoresists for circuit boards, in batteries (qv), conductive paint, copy machines, and as key components in molecular electronic devices. 

Because of its high modulus of elasticity, molybdenum is used in machine-tool accessories such as boring bars and grinding quills. Molybdenum metal also has good thermal-shock resistance because of its low coefficient of thermal expansion combined with high thermal conductivity. This combination accounts for its use in casting dies and in some electrical and electronic appHcations. 

Solders are alloys that have melting temperatures below 300°C, formed from elements such as tin, lead, antimony, bismuth, and cadmium. Tin—lead solders are commonly used for electronic appHcations, showing traces of other elements that can tailor the solder properties for specific appHcations. 

Photoconductive polymers are widely used in the imaging industry as either photosensitive receptors or carrier (electron or hole) transporting materials in copy machines and laser printers. This is still the only area in which the photoelectronic properties of polymers are exploited on a large-scale industrial basis. It is also one electronic appHcation where polymers are superior to inorganic semiconductors. 

PEN film for audio- and videotape and various electronic appHcations and blow molded PEN containers for hot-fill appHcations are already being marketed in Japan. NDA is unlikely to ever become as inexpensive as terephthaUc acid but novel NDA-based polyesters will become available if a market need exists. One example could be the experimental polyester PBN (Celanese Corp.) this is the NDA analogue of PBT, poly(l,4-butylene naphthalene-2,6-dicarboxylate) [28779-82-0]. It has a high rate of crystallization, faster even than that of PBT, and its combination of physical properties is weU-suited for injection molding. 

Electrical Properties. Polysulfones offer excellent electrical insulative capabiUties and other electrical properties as can be seen from the data in Table 7. The resins exhibit low dielectric constants and dissipation factors even in the GH2 (microwave) frequency range. This performance is retained over a wide temperature range and has permitted appHcations such as printed wiring board substrates, electronic connectors, lighting sockets, business machine components, and automotive fuse housings, to name a few. The desirable electrical properties along with the inherent flame retardancy of polysulfones make these polymers prime candidates in many high temperature electrical and electronic appHcations. 

Ceramics. Calcined aluminas are used in both electronic and stmctural ceramics (see Advanced ceramics). Electronic appHcations are dominant in the United States and Japan whereas mechanical appHcations are predominant in Europe (1). Specialty electronic integrated circuit packages generally use the low soda and thermally reactive aluminas. 

Another growing apphcation that overlaps the electrically functional area is the use of transparent conductive coatings or tin oxide, indium—tin oxide, and similar materials in photovoltaic solar ceUs and various optic electronic apphcations (see Photovoltaic cells). These coatings are deposited by PVD techniques as weU as by spray pyrolysis, which is a CVD process. 

The first commercial use of tantalum was as filaments ia iacandescent lamps but it was soon displaced by tungsten. Tantalum is used ia chemical iadustry equipment for reaction vessels and heat exchangers ia corrosive environments. It is usually the metal of choice for heating elements and shields ia high temperature vacuum sintering furnaces. In 1994, over 72% of the tantalum produced ia the world went iato the manufacturiag of over 10 x 10 soHd tantalum capacitors for use ia the most demanding electronic appHcations. 

Thiophene [110-02-1] and a number of its derivatives are significant in fine chemical industries as intermediates to many products for pharmaceutical, agrochemical, dyestuffs, and electronic appHcations. This article concentrates on the industrial, commercial, and economic aspects of the production and apphcations of thiophene and thiophene derivatives and details the main synthetic schemes to the parent ring system and simple alkyl and aryl derivatives. Functionalization of the ring and the synthesis of some functional derivatives that result, not from the parent ring system, but by direct ring cyclization reactions are also considered. Many good reviews on the chemistry of thiophene and thiophene derivatives are available (1 7). 

Less expensive coin-type cells have also been developed for consumer electronics appHcations, but the severe current limitations have restricted the use of the cells. 

The piopeities of a ceramic material that make it suitable for a given electronic appHcation are intimately related to such physical properties as crystal stmcture, crystallographic defects, grain boundaries, domain stmcture, microstmcture, and macrostmcture. The development of ceramics that possess desirable electronic properties requires an understanding of the relationship between material stmctural characteristics and electronic properties and how processing conditions maybe manipulated to control stmctural features. 

In the broad range of ceramic materials that are used for electrical and electronic apphcations, each category of material exhibits unique property characteristics which directiy reflect composition, processing, and microstmcture. Detailed treatment is given primarily to those property characteristics relating to insulation behavior and electrical conduction processes. Further details concerning the more specialized electrical behavior in ceramic materials, eg, polarization, dielectric, ferroelectric, piezoelectric, electrooptic, and magnetic phenomena, are covered in References 1—9. 

Electronic Applications. Electronic appHcations make up a significant sector of the cesium market. The main appHcations are in vacuum tubes, photoemissive devices, and scintillation counters (see Electronic materials). 

Eor more demanding uses at higher temperatures, for example, in aircraft and aerospace and certain electrical and electronic appHcations, multifunctional epoxy resin systems based on epoxy novolac resins and the tetraglycidyl amine of methylenedianiline are used. The tetraglycidyl amine of methylenedianiline is currently the epoxy resin most often used in advance composites. Tetraglycidyl methylenedianiline [28768-32-3] (TGALDA) cured with diamino diphenyl sulfone [80-08-0] (DDS) was the first system to meet the performance requirements of the aerospace industry and is still used extensively. 

Corrosion. Copper and selected copper aHoys perform admirably in many hostile environments. Copper aHoys with the appropriate corrosion resistance characteristics are recommended for atmospheric exposure (architectural and builder s hardware), for use in fresh water supply (plumbing lines and fittings), in marine appHcations (desalination equipment and biofouling avoidance), for industrial and chemical plant equipment (heat exchangers and condensers), and for electrical/electronic appHcations (coimectors and semiconductor package lead-frames) (30) (see Packaging). 

Excellent resistance to saltwater corrosion and biofouling are notable attributes of copper and its dilute alloys. High resistance to atmospheric corrosion and stress corrosion cracking, combined with high conductivity, favor use in electrical/electronic appHcations. 

Tin. Apphcation of tin on strip steel for can stock has decreased. Nevertheless, tin plating is still done in large volume, and tin plate for can stock was estimated at 11,750 t in 1990 (11). Additionally, 603 t of tin anodes were used for electroplating in electronic apphcations in the United States in 1990. The use of tin in solder manufacture is reported to exceed that used in can stock (12). The cost of tin in early 1993 was 7.50/kg (see Tin and tin alloys). 

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