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Pyrolyzed photoresist films

SV detection was also achieved to detect catecholamines on a PDMS-quartz chip. Pyrolyzed photoresist films (PPF) were used as planar carbon electrodes. Since the photoresist (AZ4330) must adhere on a substrate for pyrolysis at 1000°C, a quartz plate that could withstand high temperature was selected. The LOD of dopamine decreased from 160 nM to 100 nM when the PPF was treated by piranha solution (HjSOyHjOj). It was because such a treatment increased the surface oxygen/carbon ratio, and hence the oxidation kinetics of dopamine wave improved [765]. [Pg.219]

Figure 6.6 CVs measured at GC (a,c) and pyrolyzed photoresist films (b,d). (a,b) First scan (—) and second scan (---) (0.2Vs ) with stirring between scans in a solution of 5.2 mM 1-naphthylmethylcarboxylate and 0.1 M tetrabutylammonium tetrafluoroborate... Figure 6.6 CVs measured at GC (a,c) and pyrolyzed photoresist films (b,d). (a,b) First scan (—) and second scan (---) (0.2Vs ) with stirring between scans in a solution of 5.2 mM 1-naphthylmethylcarboxylate and 0.1 M tetrabutylammonium tetrafluoroborate...
Figure 10.3 Various structures of moiecuiar junctions commoniy used in moiecuiar eiec-tronics (a) Cross junction formed by perpen-dicuiariy oriented bottom and top contacts with a moiecuiar iayer sandwiched between the conductors. Typicai junction sizes range from severai square microns to a square mil-iimeter. (b) An aii-carbon molecular junction formed using pyrolyzed photoresist film (PPF) (on SiOj support) as a bottom contact, an evaporated carbon (eC) top contact, and a molecular layer consisting of a multilayer of biphenyl grafted using diazonium chemistry. Figure 10.3 Various structures of moiecuiar junctions commoniy used in moiecuiar eiec-tronics (a) Cross junction formed by perpen-dicuiariy oriented bottom and top contacts with a moiecuiar iayer sandwiched between the conductors. Typicai junction sizes range from severai square microns to a square mil-iimeter. (b) An aii-carbon molecular junction formed using pyrolyzed photoresist film (PPF) (on SiOj support) as a bottom contact, an evaporated carbon (eC) top contact, and a molecular layer consisting of a multilayer of biphenyl grafted using diazonium chemistry.
Nasraoui, R., J.-F. Bergamini, S. Ababou-Girard, and F. Geneste. Sequential anodic oxidations of aliphatic amines in aqueous medium on pyrolyzed photoresist film surfaces for the covalent immobilization of cyclam derivatives. J Solid State Electrochem. 15, 2011 139-146. [Pg.219]

The synthesis and electrochemical properties of carbon films prepared from positive photoresist have been reported.The initial direction for this work was the fabrication of carbon interdigitated electrodes. In this work, positive photoresist was spin coated on a silicon substrate, patterned by photolithography, and pyrolyzed to form the carbon electrode. In more recent work, laser excitation has been used to both pyrolyze the film and to write the electrode pattern. ... [Pg.244]

N.E. Hebert, B. Snyder, R.L. McCreery, W.G. Ruhr and S.A. Brazill, Performance of pyrolyzed photoresist carbon films in a microchip capillary electrophoresis device with sinusoidal voltammetric detection, Anal. Chem., 75 (2003) 4256-4271. [Pg.863]

Kostecki R, Schnyder B, Alliata D, Song X, Kinoshita K, Kotz R (2001) Surface studies of carbon films from pyrolyzed photoresist. Thin Solid Films 396 36-43... [Pg.261]

Figure 11.6 Fabrication procedure of an IDA microelectrode. An oxidized silicon wafer (A) is coated with platinum (B). Carbon film is pyrolyzed on it (C). The substrate is coated with photoresist, which is exposed and developed (D) unnecessary portions are then removed by reactive ion etching (E). After removing the photoresist, an Si3N4 layer is deposited on the substrate (G). The substrate is coated with photoresist, which is exposed and developed (H) then the desired shape of the carbon electrode is exposed by reactive-ion etching (I). [Adapted from Ref. 36.]... Figure 11.6 Fabrication procedure of an IDA microelectrode. An oxidized silicon wafer (A) is coated with platinum (B). Carbon film is pyrolyzed on it (C). The substrate is coated with photoresist, which is exposed and developed (D) unnecessary portions are then removed by reactive ion etching (E). After removing the photoresist, an Si3N4 layer is deposited on the substrate (G). The substrate is coated with photoresist, which is exposed and developed (H) then the desired shape of the carbon electrode is exposed by reactive-ion etching (I). [Adapted from Ref. 36.]...
Galvanostatic measurements on the C-MEMS array in a half-cell with lithium as both the counter and reference electrode [32] show a large irreversible capacity loss on first discharge followed by good cycling properties consistent with the behavior of conventional bulk coke electrodes. The lithium capacity normalized to the foot print area of the electrode array is 0.125 mAhcm". This value is nearly twice that of an unpattemed pyrolyzed film of SU-8 photoresist [32], The higher capacity is due to the greater active volume, contributed by the carbon posts over the footprint area (Fig. 2.10). [Pg.20]


See other pages where Pyrolyzed photoresist films is mentioned: [Pg.219]    [Pg.346]    [Pg.114]    [Pg.126]    [Pg.66]    [Pg.209]    [Pg.294]    [Pg.219]    [Pg.346]    [Pg.114]    [Pg.126]    [Pg.66]    [Pg.209]    [Pg.294]    [Pg.126]    [Pg.210]    [Pg.233]    [Pg.233]    [Pg.245]    [Pg.51]   
See also in sourсe #XX -- [ Pg.126 ]




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Pyrolyzation

Pyrolyzed photoresist films (PPF)

Pyrolyzers

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