Photoresist stripping

Photoresist stripping and residue removal will probably be the first microelectronics supercritical fluid applications integrated into IC (integrated circuit) processing. 

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Ch oline in the form of choline base (hydroxide) is a strong organic base with a pH of approximately 14. This product can have industrial apphcations where it is important to replace inorganic bases with organic materials. Ch oline base is currently used in the formulation of photoresist stripping products for use in the printed wire board industry. Dilute aqueous solutions (5%) of ch oline base that have very low concentrations of metallic ions have been utilized for apphcations in the semiconductor industry. 

The volume-loaded barrel reactor shown in Fig. 19c, is not used for applications that require anisotropic etching. A typical example is photoresist stripping. High... 

The development of the resin to form microelectrode arrays is mostly based on the lift-off process (164). A solvent dissolves the remaining soluble positive photoresist underneath the metal, starting at the edge or lip of the unexposed photoresist and lift off the metal in the process (Figure 10.13). When the photoresist is removed, all metal on top of the photoresist strip strips off automatically while metal on the top of the photoresist lines stays. 

Conveyorized equipment can also be used for, at least, innerlayer and outerlayer photoresist stripping and innerlayer and outerlayer photoresist developing, deburring, and panel scrubbing. Similar techniques to reduce water flow can be apphed to these operations. 

Aqueous and Semiaqueous Photoresist Stripping Bath Treatment... 

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