Photoresists adhesion

Adhesion has been achieved on these oxides through a variety of silane precoat treatment processes. Solutions of y-aminopropyltriethoxysilane, y-methacryloxytrimethoxysilane, and y-glycidoxytrimethoxysilane applied to thermal oxide substrates all improved resist image adhesion for conventioanl positive photoresists Mallinckrodt Multisurf also works well. Conventional liquid-phase application of HMDS, however, was not adequate for the latter three tougher substrates listed above it did provide adequate photoresist adhesion for thermal oxides, however. For the last three substrates, a double... 

The latter thicker adhesion layers are most likely polysiloxane condensation polymer layers. Photoresist adhesion to these layers may be electrostatic in nature, while the adhesion of the promoter layers to the gold substrate may be the result of chemisorption forces between the chelating moieties of the promoter layer and the gold surface atoms. 

Before determining surface condition treatment effects, the surface sensitivity enhancement of angle resolved ESCA surface analysis is demonstrated in Fig. 2. The figure clearly shows the 0, Si, and C surface concentrations to be dramatically different than the respective bulk concentrations. The silicon concentration in the top surface layer measured at 5° ESCA take-off angle, for example, is approximately 2.5X less than that obtained at a 75 take-off angle, which represents an approximate depth of 50A from the surface. Most of the surface data presented here is at the low take-off angle of 5 to concentrate primarily upon the wafer surface condition in the first 2-3 atomic layers, and how it affects polymeric photoresist adhesion. 

That is, changes in humidity and ambient carbon impurity contaminant concentrations will have little influence upon the wafer surface leading to improved photoresist adhesion reproducibility. 

So In the case of photoresist adhesion, one Is primarily concerned with the events at the photoresist-substrate Interface and how these are affected by the developer and the etchant. 

Figure 4. Prirwiple of the ion migratiori test for monitroing photoresist adhesion...

It should be added that adhesion is used here to represent inter-facial interactions, and if the Interface is susceptible to the attack of the etchant, then it may very well result into poor photoresist adhesion. 

It can be concluded from this discussion that adsorbed water on the SIO2 surface Is undesirable for photoresist adhesion. 

It is shown that the adhesion of a resist to a substrate depends upon the chemical composition of the resist, the surface characteristics of the substrate, and the various processing steps. How photoresist adhesion is Influenced by these materials and processing parameters is analyzed. It is emphasized that certain surface treatments can Influence the photoresist adhesion and mechanical adhesion (in terms of peel, pull, scratch, etc.) in different ways, and commonly used techniques to Improve mechanical adhesion of films and coatings may be fruitless or even harmful so far as photoresist adhesion is concerned. By a proper understanding of the factors affecting photoresist adhesion, one should be able to control it. 

Deverse, Process for improving photoresist adhesion, U.S. Patent... 

Uses Electron donor component of polyolefin polymerization catalyst complexes improves photoresist adhesion to silicon nitride coupling agent release agent lubricant blocking agent chemical intermediate Manuf./Distrib. ABCR http //www.abcr.de, AP Resources http //www.apr.co.kr, Acros Org. http //www.acros.be, Aldrich http //www.sigma-aldrich.com, Fluka http //www.sigma-aldrich.com... 

PEG-3 dimethacrylate Trimethylolpropane propoxylate triacrylate photoresist adhesion, silicon nitride Phenyltriethoxysilane photoresists... 

Surface Preparation. The first step in the imaging operation is surface preparation to enhance photoresist adhesion. Double-treated foils (DTFs) and foils laminated with the tooth side up (RTFs) require minimum surface preparation. Generally, a process through a tacky roller machine to remove dust and foreign material is adequate. For cores with standard foil with the shiny side up (non-tooth or drum side), a more aggressive treatment is needed. Common options include a conveyorized chemical cleaning and/or an abrasive... 

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