Photoresist polymers plasma-developable

The material can be patterned for microdevice applications. The surfaces have excellent resistance to solvents, water, acids, and bases. Typically materials can be soaked in strong solvents for the unimplanted polymer for many hours and demonstrate minimal changes in electrical properties. Specifically, the implant layer remains unchanged through photoresist spin coating, developing, and etching. The implant layer can usually be etched by an plasma. 

With respect to single layer systems (conventional, ImRe, Promote and dry developable resists), we expect that computer programs that can simulate latent image formation and development processes will become of great importance in the near future. A better understanding of the mechanism which underlies the dissolution or etching of resist layers in a developer or plasma respectively is also crucial in order to achieve the ultimate resolution of single layer photoresists. In this respect, well chosen and perfectly defined polymers are required. 

The industrial use of plasma processing has been developed mainly by the microelectronics industry since the late 1960s, for the deposition of thin film materials and plasma etching of semiconductors, metals, and polymers such as organic photoresist. The third type of plasma process for surface modification is currently used in areas other than microelectronics, namely in aerospace, automotive, biomaterials, and packaging, to name only a few examples. The potential for obtaining unique surface modifications by plasma treatment is widely recognized [7]. 

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