Polyester photoresists, polymerization

Figure 4. Kinetics of the polymerization of polyester- and epoxy-acrylate photoresists under pulsed laser irradiation at 337.1 nm in the presence of air.

Figure 5. Dependence of the rate of polymerization (Rp) on the light-intensity (Iq) upon UV-laser irradiation of polyester- (O) and epoxy- ( ) multiacrylate photoresists in the presence of air.

Use A cross-linking agent with polymerization characteristics. Product is a hard, clear, infusable resin. Uses include inks, adhesives, textile products, polyesters, and photoresists. 

Infrared spectroscopy (5.131. By following the disapearance of the IR absoipdon of the acrylic double tend one can quantitatively evaluate both the maximum rate of polymerization and the amount of residual unsaturation in the laser-cured polymer. Polymerization profiles are shown on Figure 8 for the curing of a polyester-aciylate photoresist under pulsed laser irradiation at 337.1 nm in the presence of air or pure nitrogen. The main disadvantage of IR spectroscopy is that, like gel fraction determination, it requires discrete measurements at various exposures and thus becomes a tedious, time consuming technique. 

Polymeric materials are used as the basis of photoresists for making metal patterns on printed circuit boards, and also on the individual integrated circuit devices themselves. The circuit boards are made of various glass-fibre filled epoxides and polyesters, and are usually coated with other polymeric materials to prevent tarnishing and to improve solderability. The devices that are mounted on the completed printed circuit boards may have been manufactured using polymeric photoresists or have plastics such as polypropylene and polyester films in capacitors or epoxide resins in integrated circuits and transistors. The completed boards containing various devices are often then coated in another protective polymer. Finally, electrical connections are made... 

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