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Epoxy resin cured

Because the heat distortion temperature of cured epoxy resins (qv) increases with the functionality of the curing agents, pyromellitic dianhydride is used to cross-link epoxy resins for elevated temperature service. The dianhydride may be added as a dispersion of micropulverized powder in liquid epoxy resin or as a glycol adduct (158). Such epoxies may be used as an insulating layer in printed circuit boards to improve heat resistance (159). Other uses include inhibition of corrosion (160,161), hot melt traffic paints (162), azo pigments (163), adhesives (164), and photoresist compounds (165). [Pg.500]

For resistance to acid conditions alone, traditional filled and unfilled bituminous solutions (which have economic advantages), chlorinated rubber and shellac have been used. Crosslinking coatings, e.g. amine-cured epoxy resins, often blended with coal-tar which develops resistance to oils and solvents, have obvious advantages on chemical plant. [Pg.612]

Kamon, T., Furukawa, H. Curing Mechanisms and Mechanical Properties of Cured Epoxy Resins. Vol. 80, pp. 173 — 202. [Pg.154]

Epoxy (Anhydride-Cured) Epoxy resins may be crosslinked with various anhydrides by using a tertiary amine accelerator and heat. These cured polymers generally have good chemical resistance especially to acids. [Pg.44]

RPLC-PDA is frequently used for quality control, such as the determination of free Irganox 1098 in PA4.6 (at 278 nm after dissolution/precipitation), of free Irganox 1010/1076 in PP (at 278 nm after extraction with MTBE, thus avoiding dissolution of polymer waxes), of Luperco 802 in PP (at 218 nm, after extraction with HCC13), and of Tinuvin 122 in HDPE (at 225 nm as diol). The advantages of the use of HSLC over conventional LC in QC of plastics and additives have been demonstrated, e.g. for AOs in PE, mixed phthalate esters and residual terephthalic acid in PET and partially cured epoxy resins [557],... [Pg.252]

S02-cured epoxy resin. Modified epoxy/acrylic resins (1.2 to 1.4% of sand weight) are mixed with organic peroxide (26 to 60% of resin weight), the mixture is blown into the core box and a hardening mechanism similar to the S02 process takes place. [Pg.160]

The integrated planar silver chloride electrode uses a thin layer of 150 pm polymer that consists of a heat curing epoxy resin poly-hydroxy-ethylmethacrylate (PHEMA) to immobilize the KC1 electrolyte. The potential drift of the reference electrode reduced to 59 pV/h after a conditioning phase of several hours. However, this reference electrode was only used for P02 measurement, while an external reference electrode was used for pH measurement. [Pg.305]

Epoxy resins find a large number of uses because of their remarkable chemical resistance and good adhesion. Epoxy resins are excellent structural adhesives. When properly cured, epoxy resins can yield very tough materials. They are used in industrial floorings, foams, potting materials for electrical insulations, etc. One of the principal constituents in many of the Fibre-reinforced plastics (FRP) is an epoxy polymer. [Pg.174]

Observations for cured epoxy resins and resins derived from 1,2-polybutadlene crosslinked with t-butylstyrene are reported. These resins find applications in aerospace industry, including high performance, Kevlar 49, filament wound, pressure vessels on Skylab and the Space Shuttle. [Pg.321]

With this background we can now illustrate and refine these notions with some experimental results for cured epoxy resins. [Pg.70]

The plastic deformation in several amine and anhydride cured epoxy resins has been studied. The experimental results have been reasonably interpreted by the Argon theory. The molecular parameters determined from the data based on the theory reflect the different molecular structures of the resins studied. However, these parameters are in similar enough range to also show the structural similarity in these DGEBA based systems. In general, the mechanisms of plastic deformation in epoxy resins below T are essentially identical to those in amorphouE thermoplastics. The yield stress level being related to the modulus that controls the intermolecular energy due to molecular deformation will, however, be affected by the crosslinks in the thermosets. [Pg.143]

From the variation of Tg and sub-Tg with frequency, transition maps of tn (frequency) vs. 1/T were made from which the activation energy could be determined. Table IV shows that the activation energy (Tg) of the fully cured resin at the stoichiometric ratio agrees fairly well with that reported by Senich et al. (7) for two amine-cured epoxy resins. [Pg.213]

Hans Dannenberg, "Determination of Stresses in Cured Epoxy Resins", SPE Journal, 669-675, July 1965. [Pg.236]

TRAN-BRUNI DEANIN Recycling of Cured Epoxy Resins... [Pg.243]

Birmingham DJ Clinical observations on the cutaneous effects associated with curing epoxy resins. AMA Arch Ind Health 19 365-367, 1959... [Pg.301]

Thus, the cured epoxy resin is a highly functional material whose final chemical, physical, and electrical properties dictate the ultimate utility of that material. [Pg.185]

The absorption of MEK by cured epoxy resins follows a square root of time dependence. Figure 2 shows a typical plot of MEK absorbed versus square root of time. This epoxy resin (EEW = 1060 S/eq.) was cured with P-108 at 200°C for 15 minutes. Each of the data points represents one separate experiment. In this case, four samples were immersed in MEK, and samples withdrawn at 1, 3,... [Pg.202]


See other pages where Epoxy resin cured is mentioned: [Pg.232]    [Pg.432]    [Pg.162]    [Pg.19]    [Pg.138]    [Pg.404]    [Pg.1017]    [Pg.814]    [Pg.64]    [Pg.53]    [Pg.167]    [Pg.60]    [Pg.537]    [Pg.431]    [Pg.315]    [Pg.189]    [Pg.183]    [Pg.183]    [Pg.183]    [Pg.186]    [Pg.188]    [Pg.189]    [Pg.190]    [Pg.190]    [Pg.236]    [Pg.236]    [Pg.237]    [Pg.238]    [Pg.241]    [Pg.128]    [Pg.129]    [Pg.275]   
See also in sourсe #XX -- [ Pg.302 ]




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Aerospace resins epoxy with curing agent

Anhydride curing agents, epoxy resins

Anhydride-cured epoxy resins, quaternary phosphonium compound

Cure of epoxy resins

Cured epoxy resins, homogeneity

Curing agents, epoxy resins

Curing epoxy

Curing epoxy resin test specimens

Curing humidity epoxy resin

Curing mechanisms with epoxy resins

Curing of epoxy resins

Curing-induced shrinkage in epoxy resins

Epoxy cured

Epoxy episulfide resin fast curing

Epoxy resin Amine-cured

Epoxy resin cure kinetics

Epoxy resin cure reaction

Epoxy resin curing

Epoxy resin curing agents Aliphatic amines

Epoxy resin curing agents Catalysts

Epoxy resin curing agents Dicyandiamide

Epoxy resin curing agents Imidazoles

Epoxy resin curing agents Novolac resins

Epoxy resin curing agents Poly

Epoxy resin curing agents Resols

Epoxy resin curing agents Ureas

Epoxy resin curing epoxide-acid system

Epoxy resin curing epoxide-amine system

Epoxy resin curing epoxide-phenol systems

Epoxy resin curing free radical systems

Epoxy resin curing network formation

Epoxy resin curing reactions

Epoxy resin-curing agent combinations

Epoxy resins cured with anhydrides

Epoxy resins cured with isocyanates

Epoxy resins curing mechanisms

Epoxy resins curing polymerization

Epoxy resins curing processes

Epoxy resins curing reactions summary

Epoxy resins, cured crosslink density

Resins curing

Resins, cure

Solvent curing epoxy resin

Thermal Degradation of Phosphate and Phosphite-Linked Epoxy Resins Cured by Acid Anhydride

Thermal cure of epoxy resins

UV-cure of epoxy resins

Ultraviolet Light epoxy resin curing

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