Photoresists photolithography

Photolithography Photoresist Insulators, semiconductors, and polymers <0.5 m Very high(nm-pm)... 

Photolithography Photoresist (e.g., SU-8) Physical blocking of Entire hydrophobization followed by pores in paper selective dehydrophobization ... 

Chemical vapor deposition Plasma etching Photoresist Photolithography Resistance heating Ion implantation Spin-on glass deposition Cathodic arc Ion plating... 

FIGURE 10.4 Microphotograph of the pH ISFET with an on-chip pH meter. The whole device was coated with SU-8 photoresist using standard UV photolithography, leaving a 500 pm square well as the ISFET opening. (Reproduced from [85], with permission from Elsevier.)... 

Three-dimensional electrode arrays have been fabricated using two very different micromachining methods. One approach, named carbon MEMS or C-MEMS, is based on the pyrolysis of photoresists. The use of photoresist as the precursor material is a key consideration, since photolithography can be used to pattern these materials into appropriate structures. The second approach involves the micromachining of silicon molds that are then filled with electrode material. Construction of both anode and cathode electrode arrays has been demonstrated using these microfabrication methods. 

The synthesis and electrochemical properties of carbon films prepared from positive photoresist have been reported.The initial direction for this work was the fabrication of carbon interdigitated electrodes. In this work, positive photoresist was spin coated on a silicon substrate, patterned by photolithography, and pyrolyzed to form the carbon electrode. In more recent work, laser excitation has been used to both pyrolyze the film and to write the electrode pattern. ... 

The principles of photolithography are as follows Onto the surface of a semiconductor is spread a thin film of a photosensitive composition that consists of several chemicals. This composition is called photoresist and it is characterized by the effect that it changes its solubility upon irradiation. Thus, when the thin film is irradiated through a mask, the structure of this mask is projected onto the film which changes its solubility at the exposed segments. If the photoresist con-... 

The basic steps of the lithographic process are shown schematically in Figure 1. The example shown corresponds to photolithography in which the photosensitive resist or photoresist is applied as a thin film to the substrate (Si02 on Si) and subsequently exposed in an image-wise fashion through a mask. The mask contains clear and opaque features that define the circuit pattern. The areas in the photoresist that are exposed to light are made either... 

Positive Photoresists. All positive photoresists used for conventional photolithography are two-component systems and operate on a mechanism that involves destruction of a dissolution inhibitor. These resists are formulated... 

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