Photoresist insulator

As insulation between the coil and the magnetic core, a hard-cured (to 200°C) photoresist insulator is patterned. It is a novolak polymer or polyimide about 5 fim thick, which is popular for its high insulator and photolithographic properties. This provides electrical insulation as well as a planar surface for subsequent deposition of copper cods. 

Photolithography Photoresist Insulators, semiconductors, and polymers <0.5 m Very high(nm-pm)... 

Because the heat distortion temperature of cured epoxy resins (qv) increases with the functionality of the curing agents, pyromellitic dianhydride is used to cross-link epoxy resins for elevated temperature service. The dianhydride may be added as a dispersion of micropulverized powder in liquid epoxy resin or as a glycol adduct (158). Such epoxies may be used as an insulating layer in printed circuit boards to improve heat resistance (159). Other uses include inhibition of corrosion (160,161), hot melt traffic paints (162), azo pigments (163), adhesives (164), and photoresist compounds (165). 

Manufacture of Printed Wiring Boards. Printed wiring boards, or printed circuit boards, are usually thin flat panels than contain one or multiple layers of thin copper patterns that interconnect the various electronic components (e.g. integrated circuit chips, connectors, resistors) that are attached to the boards. These panels are present in almost every consumer electronic product and automobile sold today. The various photopolymer products used to manufacture the printed wiring boards include film resists, electroless plating resists (23), liquid resists, electrodeposited resists (24), solder masks (25), laser exposed photoresists (26), flexible photoimageable permanent coatings (27) and polyimide interlayer insulator films (28). Another new use of photopolymer chemistry is the selective formation of conductive patterns in polymers (29). 

Figure 23. Processing flow for 3-D electrode array fabrication using silicon micromachining with colloidal filling of the electrode material. The six steps are identified as the following (i) patterned photoresist (PR) on silicon substrate, (ii) PR removal after DRIB micromachining, (iii) insulate silicon mold by oxidation, (iv) colloidal electrode filling material centrifuged into the mold, (v) silver epoxy added to provide mechanical stability and electrical contact, (vi) the electrode flipped over and released from the mold by immersion in a TEAOH solution.

Figure 17.11. Process steps for forming Cu interconnects using the single damascene process (dielectric patterning) (a) planarized substrate (b) dielectric deposition (c) dielectric RIE through photoresist mask (d) etched insulator (e) deposition of diffusion barrier (Ta) and Cu seed layer (/) electrodeposition of Cu into a via (vertical interconnection) ( ) CMP of Cu excess Qi) patterning and deposition of Cu line (wire).

Pattern and hard cure photoresist for insulation and planarization... 

The main application of amorphous perfluoropolymers is as cladding of optical fibers, antireflective coatings, low dielectric coatings, and in the electronic industry (e.g., photoresists)1012 and as a low-dielectric-constant insulator for high-performance interconnects.13... 

Sunfort dry film photoresist and Pimel photosensitive polymide resins. Asahi Kasei Construction manufactures Hebei ALC panels and Neoma foam insulation panels for the residential, commercial building and civil engineering... 

Organic materials are used in the existing electronics industries mainly for passive purposes insulating and structural support materials. There are, however, exceptions, such as photoresists, liquid crystal displays, and electrocopying. More challenging to many researchers in a diversity of fields is the application of organic conductors from the viewpoint of the fabrication of molecular electronics, to which this chapter is devoted. 

Chapters 1 and 2 introduce the CMP process and historical motivations. The present status of CMP is discussed in Chapter 2, which focuses on establishing the need of advanced metallization schemes and planarization. There are a large number of variables that control the process these are discussed in Chapter 3. Chapter 4 presents the science of CMP— mechanical and chemical concepts important in understanding the CMP fundamentals. The CMP of the Si02 films, the most commonly used insulator interlayer dielectric, is discussed in Chapter 5. Chapters 6 and 7 cover the CMP of the two most studied metals, W and Cu, respectively. Chapter 8 examines the applicability of CMP to new materials, e.g., Al, polymers, and Si3N4 photoresists. Finally, Chapter 9 covers post-CMP cleaning science and technology. 

After the photoresist is in place, a layer of conducting, semiconducting, or insulating metal solution is applied to the wafer and adheres in the pattern opposite to the photoresist. The application and removal of photoresist and metal solutions is repeated 10-20 times in the manufacture of a single integrated circuit. In addition to the number of... 

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