Photoresist conductive coating

Traditional appHcations for latices are adhesives, binders for fibers and particulate matter, protective and decorative coatings (qv), dipped goods, foam, paper coatings, backings for carpet and upholstery, modifiers for bitumens and concrete, and thread and textile modifiers. More recent appHcations include biomedical appHcations as protein immobilizers, visual detectors in immunoassays (qv), as release agents, in electronic appHcations as photoresists for circuit boards, in batteries (qv), conductive paint, copy machines, and as key components in molecular electronic devices. 

Manufacture of Printed Wiring Boards. Printed wiring boards, or printed circuit boards, are usually thin flat panels than contain one or multiple layers of thin copper patterns that interconnect the various electronic components (e.g. integrated circuit chips, connectors, resistors) that are attached to the boards. These panels are present in almost every consumer electronic product and automobile sold today. The various photopolymer products used to manufacture the printed wiring boards include film resists, electroless plating resists (23), liquid resists, electrodeposited resists (24), solder masks (25), laser exposed photoresists (26), flexible photoimageable permanent coatings (27) and polyimide interlayer insulator films (28). Another new use of photopolymer chemistry is the selective formation of conductive patterns in polymers (29). 

Halik and coworkers subsequently extended this process to pattern conducting polymer electrodes, such as poly(3,4-ethylenedioxythiophene) doped with polystyrene sulfonic acid (PEDOT-PSS) [11]. In this process, PEDOT-PSS is uniformly coated on a substrate that has prepattemed photoresist. The PEDOT-PSS-coated substrate is then immersed in acetone to swell the photoresist underneath the... 

There are two reincarnations of this method, schematically illustrated in Fig. 2. The first method uses a silicon or glass wafer as a substrate material, while the second method uses a nickel Plate. A silicon or glass wafer is coated by evaporation or sputtering with a conductive seed layer ( 100 nm) such as Ni or Cu or Au. A thin layer ( 50 nm) of Ti or Cr is used to enhance adhesion of the conducting layer to the silicon substrate. The wafer is then coated with a layer of photoresist, which is subsequently exposed to UV light and developed so that the... 

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