Circuit boards

This type of coil was prepared from copper cladded printed circuit board material by applying photolithographic techniques. The p.c. board material is available with difierent copper thicknesses and with either a stiff or a flexible carrier. The flexible material offers the opportunity to adapt the planar coil to a curved three dimensional test object. In our turbine blade application this is a major advantage. The thickness of the copper layer was chosen to be 17 pm The period of the coil was 100 pm The coils were patterned by wet etching, A major advantage of this approach is the parallel processing with narrow tolerances, resulting in many identical Eddy current probes. An example of such a probe is shown in fig. 10. 

Prince William Sound Prinivil Prins reaction Print bonding Printed circuit board... 

Hybrid Circuits. The use of parylenes as a hybrid circuit coating is based on much the same rationale as its use in circuit boards. A significant distinction Hes in obtaining adhesion to the ceramic substrate material, the success of which determines the eventual performance of the coated part. Adhesion to the ceramic must be achieved using adhesion promoters, such as the organosilanes. 

Fiber-reiaforced panels covered with PVF have been used for greenhouses. Transparent PVF film is used as the cover for flat-plate solar collectors (114) and photovoltaic cells (qv) (115). White PVF pigmented film is used as the bottom surface of photovoltaic cells. Nonadhering film is used as a release sheet ia plastics processiag, particularly ia high temperature pressing of epoxy resias for circuit boards (116—118) and aerospace parts. Dispersions of PVF are coated on the exterior of steel hydrauHc brake tubes and fuel lines for corrosion protection. 

Applications. The applications sought for these polymers include composites, stmctural plastics, electronics/circuit boards, aircraft/spacecraft coatings, seals, dental and medical prosthetics, and laser window adhesives. However, other than the early commercialization by Du Pont of the NR-150 B material, Httie development has occurred. These polymers are quite expensive ( 110 to 2200 per kg for monomers alone). 

Traditional appHcations for latices are adhesives, binders for fibers and particulate matter, protective and decorative coatings (qv), dipped goods, foam, paper coatings, backings for carpet and upholstery, modifiers for bitumens and concrete, and thread and textile modifiers. More recent appHcations include biomedical appHcations as protein immobilizers, visual detectors in immunoassays (qv), as release agents, in electronic appHcations as photoresists for circuit boards, in batteries (qv), conductive paint, copy machines, and as key components in molecular electronic devices. 

Printed circuit boards manufacture is aided by the use of KMnO. Alkaline permanganate solution is used to remove resin smeared on the interior hole wall of multilayered printed circuit boards. Additionally the hole wall is etched, resulting in a surface with excellent adhesion characteristics, for electrodeless copper (250). The alkaline permanganate etchback system containing >60 g/L KMnO and 40-80 g/L NaOH at 70—80°C, is effective for difunctional, tetrafiinctional, and polyimide resin substrates, where the level of etchback is direcdy proportional to the immersion time (10—20 min) (251). 

Alkaline solutions consisting of approximately 160 g/L NaAlnO and 60 g/L NaOH at 75°C and contact times in the range of 15 minutes, exhibit high etch rates for printed circuit boards (252,253). The resulting manganese residues can readily be removed by acid neutrali2ation. Addition of K", Rb", and Cs" as co-ions to an alkaline NaAlnO solution maintains etch rates of resin substrates comparable to solutions of higher NaAlnO concentrations (254). 

Cadmium usage, illegal in most of Europe, is being discouraged elsewhere. The U.S. military has cadmium specifications for electronic, fastener, and marine equipment, which requires only cadmium. Tin is being substituted for tin—lead as a metallic etch resist during printed circuit board production. 

Fig. 1. The different levels of electronic packaging (0) chip (1) chip carrier (2) printed circuit board (electronic card assembly) (3) rack and (4) system (2).

Most of the laminates used for rigid printed circuit boards have been classified, by the National Electrical Manufacturers Association (NEMA), according to the combination of properties that determine the suitabiHty of a laminate for a particular use. Eiber reinforcements make laminate-effective properties orthotropic. 

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