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Rates, dissolution

This weakening of Ni-Ni surfaee bonds by adsorbed sulfiir might lead one to expeet that the eorrosion rate should inerease in this ease. In faet, an inereased anodie dissolution rate was observed for Ni Fe (100) in 0.05 M H2SO4 [9], Figure A3.10.4 shows the anodie polarization eiirves for elean and S-eovered single-erystal alloy surfaees. While both surfaees show the expeeted eurrent inerease with potential inerease, the sulfur-eovered surfaee elearly has an inereased rate of dissolution. In addition, the sulfiir eoverage (measured using... [Pg.925]

In all cases of localized corrosion, tlie ratio of the catliodic to tlie anodic area plays a major role in tlie localized dissolution rate. A large catliodic area provides high catliodic currents and, due to electroneutrality requirements, tlie small anodic area must provide a high anodic current. Hence, tlie local current density, i.e., local corrosion rate, becomes higher witli a larger catliode/anode-ratio. [Pg.2728]

Corrosion suppression by inhibitors can be achieved by adding chemical species to tlie environment, which lead to a strong reduction of tlie dissolution rate. Depending on tlieir specific action, corrosion inliibitors can be divided into tlie following groups. [Pg.2730]

Positive-Tone Photoresists based on Dissolution Inhibition by Diazonaphthoquinones. The intrinsic limitations of bis-azide—cycHzed mbber resist systems led the semiconductor industry to shift to a class of imaging materials based on diazonaphthoquinone (DNQ) photosensitizers. Both the chemistry and the imaging mechanism of these resists (Fig. 10) differ in fundamental ways from those described thus far (23). The DNQ acts as a dissolution inhibitor for the matrix resin, a low molecular weight condensation product of formaldehyde and cresol isomers known as novolac (24). The phenoHc stmcture renders the novolac polymer weakly acidic, and readily soluble in aqueous alkaline solutions. In admixture with an appropriate DNQ the polymer s dissolution rate is sharply decreased. Photolysis causes the DNQ to undergo a multistep reaction sequence, ultimately forming a base-soluble carboxyHc acid which does not inhibit film dissolution. Immersion of a pattemwise-exposed film of the resist in an aqueous solution of hydroxide ion leads to rapid dissolution of the exposed areas and only very slow dissolution of unexposed regions. In contrast with crosslinking resists, the film solubiHty is controUed by chemical and polarity differences rather than molecular size. [Pg.118]

Numerous studies have probed how novolac microstmcture influences resist hthographic properties. In one example, a series of resists were formulated from novolacs prepared with varying feed ratios ofpara-jmeta-cmso. These researchers found that the dissolution rate decreased, and the resist contrast increased, as thepara-jmeta-cmso feed ratio increased (33). Condensation can only occur at the ortho position ofpara-cmso but can occur at both the ortho- and i ra-positions of meta-cmso. It is beheved that increased steric factors and chain rigidity that accompany increasedpara-cmso content modify the polymer solubihty. [Pg.122]

Any one of the five basic processes may be responsible for limiting the extraction rate. The rate of transfer of solvent from the bulk solution to the soHd surface and the rate into the soHd are usually rapid and are not rate-limiting steps, and the dissolution is usually so rapid that it has only a small effect on the overall rate. However, knowledge of dissolution rates is sparse and the mechanism may be different in each soHd (1). [Pg.87]

Two observations relevant to ECM can be made. (/) Because the anode metal dissolves electrochemicaHy, the rate of dissolution (or machining) depends, by Faraday s laws of electrolysis, only on the atomic weight M and valency of the anode material, the current I which is passed, and the time t for which the current passes. The dissolution rate is not infiuenced by hardness (qv) or any other characteristics of the metal. (2) Because only hydrogen gas is evolved at the cathode, the shape of that electrode remains unaltered during the electrolysis. This feature is perhaps the most relevant in the use of ECM as a metal-shaping process (4). [Pg.306]

Quahty control during manufacture and of the final product assures batch-to-batch consistency and reflabiUty. Bioavadabihty is checked in early batches produced for clinical testing. Other tests include uniformity of weight and contents, hardness (qv), disintegration rate, dissolution rate, and friabihty. [Pg.229]

Zirconium-hearing 75% ferroshicon is used as an iaoculant ia both gray and ductile iron. The ahoy contains 70—80% Si, 0.4—1.5% Ca, 1—1.8% Al, and 0.25—3.5% Zr. Because of its high dissolution rate, it can be added ia the ladle or ia-stream iaoculant. This ahoy gives excehent chill reduction. [Pg.541]

Rhovanil Pine Mesh, a specially caUbrated extra pure vanillin that avoids demixing with other very fine dry ingredients such as sucrose, flour, and dextrose, provides a faster dissolution rate at lower stirring, at lower temperature, in low acidity medium, or in viscous Hquids. [Pg.398]

Beryllium fluoride is hygroscopic and highly soluble in water, although its dissolution rate is slow. FluoroberyUates can be readily prepared by crystallization or precipitation from aqueous solution. Compounds containing the BeP ion are the most readily obtained, though compounds containing other fluoroberyUate ions can also be obtained, eg, NH BeF, depending upon conditions. [Pg.75]

Coated fertilizers achieve controlled release by coating a soluble fertilizer core (substrate) with a water-insoluble barrier which limits the access of water to the fertilizer and thus limits its dissolution rate. [Pg.130]

The low activation energies suggested that the dissolution rate is controlled by counterdiffusion of organic components from the coal surface and dissolved hydrogen from the solvent. Also, the rate of dissolution appeared to depend exponentially on hydrogen partial pressure. [Pg.2373]

Yagi and Wakao (1959) used mass transfer measurement results to estimate the heat transfer coefficient at the tube wall. Material was coated on the inner surface of the packed tubes and the dissolution rate was measured. [Pg.20]

Tseng et al. [164] suecessfully used UNIFAC to optimize polymer-solvent interactions in three-solvent systems, determining polymer activity as a function of the solvent eomposition. The composition yielding the minimum in polymer aetivity was taken as the eriterion for optimum interaetion, and it eompared well with experimental measurements of dissolution rate and solution clarity. Better agreement was obtained using UNIFAC than using solubility parameter methods. [Pg.63]

Cathodic Protection-a means of reducing the corrosion rate of a metal surface by passing sufficient cathodic current to it to cause its dissolution rate to become very low. [Pg.47]

The starting material and shock-activated powder were mixed with 5-wt% MgO and heated for various periods. At the end of each period the phase content of the samples was determined with x-ray diffraction. In this environment it is thought that the phase is formed by a dissolution-precipitation process as shown in Fig. 7.8. As indicated in Fig. 7.9, the shock-activated silicon nitride displays substantially enhanced dissolution rates that are strongly dependent on shock pressure between 22 and 27 GPa. [Pg.173]

Fig. 7.8. High temperature conversion of a-silicon nitride with an MgO additive to the p-pha.se is thought to be a consequence of dissolution of the a phase in a magnesium silicate with subsequent recrystallization from the melt. Enhanced dissolution rate should then strongly influence a. p conversion [84B01]. Fig. 7.8. High temperature conversion of a-silicon nitride with an MgO additive to the p-pha.se is thought to be a consequence of dissolution of the a phase in a magnesium silicate with subsequent recrystallization from the melt. Enhanced dissolution rate should then strongly influence a. p conversion [84B01].
In a detailed study the dissolution kinetics of shock-modified rutile in hydrofluoric acid were carefully studied by Casey and co-workers [88C01], Based on the defect studies of the previous sections in which quantitative measures of point and line defects were obtained, dissolution rates were measured on the as-shocked as well as on shocked and subsequently annealed powders. At each of the annealing temperatures of 200, 245, 330, 475, 675, 850, and 1000 °C, the defects were characterized. It was observed that the dissolution rates varied by only a factor of 2 in the most extreme case. Such a small effect was surprising given the very large dislocation densities in the samples. It was concluded that the dissolution rates were not controlled by the dislocations as had been previously proposed. [Pg.174]


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Dissolution rate, continuous-flow

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Dissolution rate, factors affecting

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Dissolution rate/time

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Drug substance dissolution rate

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Muscovite dissolution rates

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Negative difference effect dissolution rates

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Solutes dissolution rate

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Uniform surface dissolution rate

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