Photoresists epoxy

PEG-3 trimethylolpropane triacrylate SR 344 SR 349 SR 454 SR 506 curing agent, phenolic resins p-Toluene sulfonic acid curing agent, photopolymers SR 351 SR 399 SR 454 SR 506 1,1,1-Trimethyioipropane triacryiate curing agent, photoresists Epoxy acryiate... 

The unique electronic stmcture of CNTs makes them ideal candidate materials for composite devices. SWNT/poly (3-octylthiophene) composite possesses properties suitable for use in photovoltaic cells.Composites with PMPV have been reported to be effective in organic light-emitting diodes as electron transport layers.Actuators based on SWNT/Nafion composites have potential applications as microswitches and artificial muscles. CNT/polyimide composites have been investigated for use as ultrafast optical switches. Such materials exhibited optical delay times less than 1 ps at a wavelength of 1.55 pm and showed great potential as all-optical switches. MWNTs dispersed in a photoresist epoxy can be applicable in the production of microelectromechanical systems such as electroplating molds, sensors, and aauators. ... 

Because the heat distortion temperature of cured epoxy resins (qv) increases with the functionality of the curing agents, pyromellitic dianhydride is used to cross-link epoxy resins for elevated temperature service. The dianhydride may be added as a dispersion of micropulverized powder in liquid epoxy resin or as a glycol adduct (158). Such epoxies may be used as an insulating layer in printed circuit boards to improve heat resistance (159). Other uses include inhibition of corrosion (160,161), hot melt traffic paints (162), azo pigments (163), adhesives (164), and photoresist compounds (165). 

The majority of 2-methylphenol is used in the production of novolak phenoHc resins. High purity novolaks based on 2-methylphenol are used in photoresist appHcations (37). Novolaks based on 2-methylphenol are also epoxidized with epichlorohydrin, yielding epoxy resins after dehydrohalogenation, which are used as encapsulating resins in the electronics industry. Other uses of 2-methylphenol include its conversion to a dinitro compound, 4,6-dinitro-2-methylphenol [534-52-1] (DNOC), which is used as a herbicide (38). DNOC is also used to a limited extent as a polymerization inhibitor in the production of styrene, but this use is expected to decline because of concerns about the toxicity of the dinitro derivative. 

Figure 23. Processing flow for 3-D electrode array fabrication using silicon micromachining with colloidal filling of the electrode material. The six steps are identified as the following (i) patterned photoresist (PR) on silicon substrate, (ii) PR removal after DRIB micromachining, (iii) insulate silicon mold by oxidation, (iv) colloidal electrode filling material centrifuged into the mold, (v) silver epoxy added to provide mechanical stability and electrical contact, (vi) the electrode flipped over and released from the mold by immersion in a TEAOH solution.

Cationic photoinitiators are used in coatings, printing inks, adhesives, sealants, and photoresist applications. Most of the applications involve vinyl ether polymerizations or ringopening polymerizations of epoxy monomers (Sec. 7-2b). 

Figure 1 shows a schematic representation of the polymer network obtained by laser curing of a photoresist based on a bis-phenol A epoxy-... 

Figure 4. Kinetics of the polymerization of polyester- and epoxy-acrylate photoresists under pulsed laser irradiation at 337.1 nm in the presence of air.

Table I. Rates and Quantum Yields of Polymerization of an Epoxy-diacrylate Photoresist Exposed to Conventional or Laser UV-irradiation...

Figure 5. Dependence of the rate of polymerization (Rp) on the light-intensity (Iq) upon UV-laser irradiation of polyester- (O) and epoxy- ( ) multiacrylate photoresists in the presence of air.

Figure 6. Dependence of the polymerization quantum yield ( ) on the light-intensity (Iq) in the laser-induced polymerization of epoxy-acrylate photoresists (— expected variation of on I0 for a half-order kinetic law).

In a first step, the negative working photoresist SU-8 is spin-coated on to the disk and soft baked [110]. The disk is then UV-exposed to pattern the bottom layer. A silver thin metal layer is thereafter evaporated. The metal layer is spin-coated with an AZ-type photoresist, dried, exposed and developed. In this way, the metal layer can be developed independently from the patterning of the SU-8 layer underneath. The metal layer is patterned by wet-chemical etching. As a next step, a second SU-8 layer is deposited, soft-baked and exposed. Top and bottom layers are now developed. After a hard bake, a second CaF2 disk is attached to the stack and sealed by a light-curing epoxy resin. 

What is the developer solution used for the photopattemable epoxy-based photoresist (SU-8) [236,271,748,762] (2 marks)... 

Epoxy resins have great and wide commercial applications and are used in many industries. About 45% of production is used in protective coatings and the remainder in various applications such as composites, laminates, casting, molding, tooling, construction, adhesives, photoresists, and others. 

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