Development, positive photoresist lithographic

Microlithography, Xerography. Because of their photosensitivity, polysilanes are under intense investigation for use as positive photoresist materials (94) (see Lithographic resists). They are particularly attractive because both wet and dry development techniques can be used for imaging (131,132). The use of polysilanes for xeroprinting has been reported (133). Thermal and optical sensors based on the photodegradation of polysilanes have been developed (134). 

As integrated circuit features shrink below 03 fita, the need for optimization of all lithographic steps is crucial. In order to define such features with high precision, the processing behavior of the photoresist materials used for patterning must be well-diaracterized. Hence, we need a fundamental understanding of their development behavior. Although much of the current semiconductor industry uses diazonaphthoquinone-based positive resists, many details of the dissolution mechanism of these materials are still unknown. 

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