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Aluminium layer

Another problem in the construction of tlrese devices, is that materials which do not play a direct part in the operation of the microchip must be introduced to ensure electrical contact between the elecuonic components, and to reduce the possibility of chemical interactions between the device components. The introduction of such materials usually requires an annealing phase in the construction of die device at a temperature as high as 600 K. As a result it is also most probable, especially in the case of the aluminium-silicon interface, that thin films of oxide exist between the various deposited films. Such a layer will act as a banier to inter-diffusion between the layers, and the transport of atoms from one layer to the next will be less than would be indicated by the chemical potential driving force. At pinholes in the AI2O3 layer, aluminium metal can reduce SiOa at isolated spots, and form the pits into the silicon which were observed in early devices. The introduction of a tlrin layer of platinum silicide between the silicon and aluminium layers reduces the pit formation. However, aluminium has a strong affinity for platinum, and so a layer of clrromium is placed between the silicide and aluminium to reduce the invasive interaction of aluminium. [Pg.220]

The contact between the aluminium layers and the ceramic substrate requires a joining material which will wet both metal and ceramic, and solders such as the conventional Pb-Sn alloy have been used which are molten during the annealing process. The contact between the solder and the aluminium layer is frequently unsatisfactoty because of the intervention of the AI2O3 layer, and a practical solution appears to be to place drree layers of metal clrromium in contact widr the aluminium, copper in contact with the clrromium, and gold between the copper layer and the solder. [Pg.220]

Figure 12.8 shows the photo of a deposited aluminum layer obtained potentio-statically on a mild steel substrate at -0.3 V (vs. Al) for 4h in the upper phase of the mixture [EMIM] TFSA/6 M AICI3. The substrate was electrochomically etched at 1V (vs. Al) for 2 min prior to electrodeposition. The aluminium layer adheres so well that it can be mechanically polished to a mirror appearance. [Pg.359]

The substrate was usual 1.1 mm glass with sputtered aluminium layer. Ni was used as a catalyst. For optimization of cathode surface topography, three types of samples were prepared, with different catalyst distribution on the substrate. Catalyst layer in the first sample was uniform sputtered Ni layer. In the second and the third samples, the catalyst sputtering was produced through screens with 1 mm h 50 pm holes correspondingly. The distance between holes compared with the twice island diameter. The total area of each cathode sample was about 0.5 cm2. Cathodes are shown on Fig. 1. [Pg.266]

For measuring the Al-polymer (PP) peel strengths the plasma polymerization was performed using the previously described reactor. Then, the plasma polymer coated polymer samples were transferred into a separate electron beam metallizer (Auto 306, Edwards, UK). The thickness of deposited aluminium layers was adjusted to 150-200 nm using a quartz microbalance. The metal peel-... [Pg.64]

Zhao, H. and Vance, G. F. (1997). Intercalation of carboxymethyl-p-cyclodextrin into magnesium-aluminium layered double hydroxides. J. Chem. Soc., Dalton Trans., 1961. [Pg.327]

As opposed to absolute barriers such as an aluminium layer of at least 6 to 7 pm, the effectiveness of functional barrier systems is related to a functional quantity in terms of mass transfer, which is dependent on the technological and application-related parameters of the respective food-package system. These parameters are ... [Pg.217]

Microwave susceptors are used for crisping and browning food in a microwave oven. The susceptor is a multi-layer material usually made of a paper layer, a thin aluminium layer and finally a polyethylene terephthalate layer which is in contact with the food. The susceptor absorbs the energy of the microwaves and this heat is transferred to the food resulting in a crispy surface at the part in contact with the food. [Pg.375]

In order to remove the reaction by-products and other impurities the as-prepared nanociystals were precipitated by the addition of non-solvent (typically, 2-Propanol) and redissolved in pure water. Indium tin oxide (ITO) coated glass slides (13 Ohm/cm thickness of ITO layer of 125 nm, unpolished, Merck) were used as substrates for LbL assembly and as transparent positive electrodes. Aluminium layers evaporated with a lab coating machine B30.3-T (Malz Schimdt) play a role of cathode. PL measurements were performed at room temperature using a FluoroMax-2 spectrofluorimeter (Instruments SA). Electroluminescence spectra were measured with the same device by positioning the NEED in the focus of the detecting channel. [Pg.606]

In aluminium reduction cells the carbon anode is placed in the upper part of the bath parallel to the liquid aluminium layer at the bottom, which acts as the cathode. The electrolyte between these electrodes consists of cryolite melt Na3AlF6 and alumina A1203 dissolved in it it may also contain such admixtures as A1F3, CaF2 and others. Dissolving of alumina in the bulk of the cell may be described as follows ... [Pg.141]

Fig. 2 is the cross-section of. Al-Cu densiw functionally graded material. It shows that there were no micro cracks, and the transition between layers was in a good state. Fig. 3 gives the result of elemental macro linear analysis. From Fig. 3, it can be seen that the Cu element content increases along FGNfs thickness, while that of, A1 decreases. The relative density of gradient layers are low but the solid aluminium layer and copper layer are high, which due to the oxidization of aluminium powder on the. surface [7]. It can reject the reaction of aluminium and copper. The detailed anah sis of oxide content in aluminium panicles will be... [Pg.309]

Because of the low process temperatures the resist can be easily adapted on plastic films as the substrate material. Here OFETs are first integrated on a 23 pm thick polyester foil that is cut to a diameter of 100 mm, cleaned in acetone and deionised water, dried and put on a silicon wafer in order to be processed by the equipment of the silicon semiconductor technology. A 150 nm thick aluminium layer serves as the common gate electrode for the electrical analysis of the devices. [Pg.376]

First, we show an XPS analysis of the P(VDF-TrFE)/Al interfaee, in top electrode geometry. Figure 21.5 shows an XPS spectrum of a P(VDF-TrFE) film after evaporation of a thin aluminium layer (around 1 nm). Compared to the spectrum of the bulk P(VDF-TrFE) film without aluminium, we find the following modifications (i) the relative intensity between CH2 and CF2 peaks is modified towards lower fluorine content, approximately from CH2/CF2 = 0.8 before and CH2/CF2 = 1.0 after evaporation (ii) a small shift of CH2, CFH and CF2 and (iii) a new peak at lower binding energies. This is a clear indication of a surface reaction. [Pg.457]

When the equivalent of 1/8 of aluminium layer (as calibrated with a quartz microbalance) is deposited onto the virgin polymer (Fig. 3b). the first striking observations are as follows ... [Pg.162]

However, most commercially available metallised samples do not provide enough barrier properties for long term applications, mainly due to water transmission through the large density of pin holes and micro-defects present in the sputtered aluminium layers [20]. [Pg.168]

SIMS profiles of Si, Al and 0 measured at the interface AI-ZERODUR in a sample covered by an aluminium layer and annealed at 400°C for 15min. [Pg.78]

The electrodeposition of a thin aluminium layer was performed from a chloroalumrnate ionic liquid (AlCl3/[C4mim][Cl] molar ratio 2/ 1) on Al- Li P90 alloy [45]. A crucial aspect was the superficial treatment applied before the aluminium deposition, performing mechanical polishing inside a globe box where... [Pg.206]

Single-dose oral powders in powder paper can be packaged in a plastic bag with a clip. Single-dose oral powders can also be packaged in small sealed pouches from a laminate foil material including an aluminium layer. These primary containers are called sachets. Next to the use as primary container, bags are also used as secondary container. [Pg.527]

A more interesting type of anisotropy, trimodal, is illustrated in Figure 6, here encountered with an aged monolayer of 22-tricosenoic acid deposited on to an evaporated aluminium layer. The three peaks of the PDF are at 27 and 0 approximately. The low-deviation crystallites are seen to form a continuous matrix, with very good long range order. [Pg.383]

In the first case a chemical attack of the Zerodur material is desired. In the second case the chemical treatment should not attack the Zerodur material in a noticeable way, only the coating (normally an aluminium layer) is to be dissolved. [Pg.196]

Hussein, M.Z.B. Yun-Hin, T.Y. Tawang, M.M. Shahadan, R. Thermal degradation of (zinc-aluminium-layered double hydroxide-dioctyl sulphosuccinate) nanocomposite. Mater. Chem. Phys. 2002, 74, 265-271. [Pg.282]


See other pages where Aluminium layer is mentioned: [Pg.425]    [Pg.469]    [Pg.76]    [Pg.360]    [Pg.426]    [Pg.233]    [Pg.142]    [Pg.391]    [Pg.314]    [Pg.195]    [Pg.386]    [Pg.57]    [Pg.454]    [Pg.498]    [Pg.25]    [Pg.201]    [Pg.204]    [Pg.205]    [Pg.207]    [Pg.721]    [Pg.115]    [Pg.28]    [Pg.148]    [Pg.187]    [Pg.140]    [Pg.331]   
See also in sourсe #XX -- [ Pg.190 , Pg.193 , Pg.194 ]




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